Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
It’s Only Common Sense: Trust Is All You Need
Orbotech AOS Solution Aims to Increase PCB Yield
May 18, 2016 | PRNewswireEstimated reading time: 2 minutes
Orbotech Ltd has launched the Precise 800 Automated Optical Shaping (AOS) System at CTEX 2016 in Suzhou, China. The Precise™ 800 is the first solution for advanced High Density Interconnect (HDI) and complex multi-layer PCB manufacturing that is capable of both removing (or ablating) excess copper ("shorts") and depositing missing copper ("opens"). This one-stop 3D shaping solution increases printed circuit boards (PCB) yield significantly by practically eliminating scrap, thus allowing PCB manufacturers to increase cost savings, lower their overall cost of ownership and achieve a faster return on their investment (ROI).
"The Precise 800 is a unique innovative implementation of digital additive manufacturing and represents a complete breakthrough in electronics micro-manufacturing production processes. It is based on an additive technology that was developed by Orbotech over a number of years," said Arik Gordon, Corporate Vice President and President of Orbotech's PCB Division. "Our customers are under continual pressure to produce cost-sensitive, ever-smaller, functionality-rich devices in high volumes. The Precise™ 800 meets their requirements by providing high-quality, meticulous shaping of PCBs that might otherwise have been scrapped."
The Precise 800's ability to automate the PCB shaping process swiftly and accurately is enabled by two new Orbotech proprietary technologies—3D Shaping (3DS) Technology and Closed Loop Shaping (CLS) Technology. 3DS is based on a series of processes, including 3D defect analysis, 3D laser shaping and 3D visualization. By comparing the shape of the defect to real-time computer-aided manufacturing (CAM) data and simultaneously conducting 3D analysis, 3DS automatically identifies where copper needs to be added. It then guides the system's laser to Orbotech's Precise Stick, a high-quality metal carrier, for precise copper deposition. The results—which must meet strict manufacturing specifications for electrical characteristics, durability and visual properties—can be confirmed immediately with 3D visualization.
CLS leverages specialized image analysis algorithms to make real-time comparisons between the actual image and the design data (CAM) in order to detect the precise location of the shorts and opens. It then intelligently guides the system's laser to ablate excess copper with high accuracy.
The Precise 800 AOS System is now available to customers worldwide.
About Orbotech Ltd
Orbotech Ltd (NASDAQ: ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, click here.
Share on:
Suggested Items
TT Electronics Secures £20 Million in Aerospace and Defence Contracts as European Programmes Accelerate
06/06/2025 | TT ElectronicsTT Electronics has been awarded more than £20 million in new and renewed defence contracts, marking a major step forward in its contribution to Europe’s rapidly evolving defence landscape.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
Essemtec USA Welcomes Frank Hart as Head of Sales for North America
06/05/2025 | Essemtec USAEssemtec USA is proud to announce the appointment of Frank Hart as Head of Sales for North America, effective immediately. With over 30 years of experience in the SMT industry, Frank brings a wealth of knowledge, leadership, and a strong track record of success to our team.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswireNew Era Electronics, a leading provider of high-performance industrial computing solutions, announces the establishment of its first United States location in Salt Lake City, Utah. This strategic expansion to the U.S. underscores New Era Electronics' commitment to enhancing supply chain continuity and delivering exceptional services across North America.