Thousands Converge at IMS2016 to Build Future of Wireless Connectivity
May 23, 2016 | IMSEstimated reading time: 3 minutes
Thousands of attendees will convene for the IEEE MTT-S 2016 International Microwave Symposium (IMS) May 22-27 at San Francisco’s Moscone Center to discuss the latest microwave and RF advancements in emerging areas around wireless connectivity. With a theme of “the Gateway to the Wireless Future,” IMS2016 will also feature a sold-out show floor with a record-breaking 630 exhibitors from around the world debuting the latest advancements in communications, defense, wearable electronics, medical applications, virtual reality and more.
IMS, the annual conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S), is the premier international meeting for technologists involved in all aspects of microwave theory and practice. Products and innovations at IMS are quickly becoming key components for next generation technologies such as virtual and augmented reality, 5G, automobile radar, the Internet of Things, and even commercial drones. Millimeter-wave technology will also be a major trend, with a significant number of technical sessions and workshops dedicated to the topic as engineers explore ways to increase bandwidth and reduce interference for wireless devices.
“From autonomous vehicles to augmented reality, we’re seeing incredible advancements in technology, but we need to ensure we have an adequate infrastructure to support these emerging applications,” said Dr. Amarpal Khanna, IMS2016 general chair. “IMS is truly the gateway to the wireless future where the technical community convenes to share research and discuss the solutions that will make these technologies a reality.”
Along with a three-day exhibition and full schedule of 75 technical sessions, IMS2016 will also feature IEEE’s Interactive Mars Exploration Vehicle (MEV) experience, a cooperative experience in which three players, each using a VR headset and microphone, virtually command a planetary exploration vehicle and collaborate to accomplish a series of missions. Players appear inside the game as 3D digital avatars but must communicate verbally to manipulate the rover controls and operate the vehicle. This hands-on demonstration showcases how microwave and RF technology makes many of today’s greatest innovations possible, but also explores the future of human interaction with and within virtual environments.
The MEV experience is a part of the symposium’s Wearables & Wireless Pavilion, which showcases emerging wearable electronics that utilize RF and microwave technologies. Curated and sponsored by Wireless Design and Development, the Pavilion will feature a number of consumer-facing technologies including a smart driving assistant, the first home wireless system, and devices that don’t just think, but instinctively react to their surroundings.
Additionally, IMS2016 will feature speakers from major players such as Google, Facebook, Mediatek, Apple and Amazon. The expansion of participation in this year’s show illustrates the importance of RF and microwave technology and research within the broader technology industry. More than 80 exhibitors from Asia, spanning a wide range of countries including China, Japan, and more, will participate in the symposium’s exhibition. IMS was most recently named one of Trade Show News Network’s top 50 fastest-growing shows in the United States.
As the centerpiece of Microwave Week 2016, IMS2016 will also share the stage with the RFIC Symposium and the ARFTG Conference. The conference consists of a full week of events, including technical paper presentations, workshops and tutorials, and an exhibition featuring more than 630 companies.
Registration
IMS2016 registration is available onsite in the south hall of the Moscone Center. For more details on IMS2016 registration click here.
About IMS
The International Microwave Symposium (IMS) is the annual conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S). IMS features a large trade show with a large commercial exhibition featuring over 600 companies and a technical program offering technical sessions, interactive forums, plenary and panel sessions, workshops, short courses, application seminars, and a wide variety of other technical and social activities. The program will cover the latest microwave and RF advancements in emerging areas such as 5G, automobile radar, wearable electronics, the Internet of Things, wireless HDMI, medical applications, satellite communications, and more.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.