Nolan's Notes: The Next Killer App in Component Manufacturing
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
IPC Standards Committee Reports, Part 2 – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency
June 6, 2016 | IPCEstimated reading time: 5 minutes
These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.
Assembly and Joining
The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at the 2016 Fall Standards Meetings in September.
The 5-21A Component mounting subcommittee met to discuss the update of the Guidelines for Printed Board Component Mounting. The new document, IPC-7070 will be created by combining parts of IPC-770, IPC-7351B, IPC-7093 and IPC-7095. The goal is to gather all the component information into one document to make it more user friendly.
The 5-21f Ball Grid Array Task Group continued its review of the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. The task group identified several areas to be updated or added, including column grid arrays and solder column assembly, addressing 0.3-mm and variable pitches and supply chain issues.
The 5-21g Flip Chip Mounting Task Group met to solicit feedback on topics which need to be updated or added in IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. Based on the number of significant changes requested by industry, the group will determine if IPC-7094 requires a full revision or an amendment. Topics under consideration include wafer-level fan-in/fan-out processes, very fine pitches and high I/O variations.
The 5-21h Bottom Termination Components Task Group reviewed proposed new content and content updates for the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components. The group has identified several needs to bring the document up to current technology, including addressing low-temperature alloys, adding pictures of latest-technology BTCs, discussing 1-mm to 4-mm BTCs and managing supply chain issues.
The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. For the first time, the group also met at the same time with the Task Groups working on IPC-A-610, Acceptability for Electronic Assemblies and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies to resolve differences between the three documents addressing the same criteria.
The 5-22ad Requirements for Military Systems Work Group continued a discussion on content to address hardware contracted by the U.S. Department of Defense and used in military systems. They previously discussed a separate addendum, however during this meeting, they took action to review the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies. They are considering a joint effort with that Task Group.
The 5-22as Task Group discussed review comments from the Final Industry Review of the addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22h Thermal Profiling Guide Task Group met to review final document needs for the task group to distribute the working draft of IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) for comments. The task group plans to publish IPC-7530A by the end of the year. This will be the document’s first revision since its publication in 2001.
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