Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Computrol Triples Its Medium Volume Inspection Capability with Three Koh Young SPI Systems
June 14, 2016 | Computrol, Inc.Estimated reading time: 1 minute
Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.
Computrol’s medium-volume customers will benefit from the KY-8030’s rugged dependability and all of the benefits of in-line 3D SPI. The KY-8030-3 uses patented Koh Young shadow-free inspection technology and software to deliver 100 percent 3D inspection of solder paste. It delivers superior value and offers true patented 3D volume measurement. Additionally, the following features will help Computrol continue to offer world-class manufacturing to its customers:
- No false calls – no escapes – no shadow problems
- Highest accuracy and repeatability
- No PCB color sensitivity
- Solder paste printing optimization - at its best
- Accurate, powerful SPC tool package
Computrol installed two of the systems at its Meridian, ID plant and one at its Orem, UT facility. “We purchased this system to better meet the high quality demands of our customers,” said James Spencer, Engineering Manager for Computrol.
About Computrol, Inc.
Computrol, Inc., with manufacturing facilities in Meridian, Idaho and Orem, Utah, is a leading national provider of high-quality, low-volume electronics manufacturing capabilities, serving military, medical, aerospace, broadcast and general industry customers.
About Koh Young Technology
Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection
equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China (Shenzhen) and Korea.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.