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IPC Unveils Results of IPC Rework Experience Competition at SMT Hybrid Packaging 2016
June 15, 2016 | IPCEstimated reading time: 1 minute
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Over the three-day show, participants in the rework challenge had to assemble area array devices and fine pitch packages, and then remove the packages from the board. Competitors then reworked the board to make it functional again. Before the show, participants were given an opportunity see information on the board type and components. The boards were examined and rated by a third party IPC Master Instructor.
“The best-of-the-best hand soldering rework specialists came to compete at this event,” said David Bergman, IPC vice president of international relations. “The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering rework competitions across the globe.”
Bergman added, “IPC would like to thank the rework experience competition gold sponsor: kurtz ersa; silver sponsors: Balver Zinn, and Elmatica; bronze sponsors: HP Etch, HumiSeal, Piek, and Practical; and contest contributors: Global SMT & Packaging and NPL for their support.”
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Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
09/17/2024 | Chris Mitchell -- Column: The Government CircuitSeptember in the United States is the season for back-to-school and football. In the arena of government policy advocacy, it’s the season for election campaigning and wrapping up the work of the current session of Congress. This month, there will be a flurry of efforts in Congress by legislators to complete action on “must-do” legislation, especially spending plans for FY25, which begins Oct. 1. In October, there will be a recess for the home stretch of the campaign; in November and December, there will be one more round of policy action by the “lame duck” office holders before the new U.S. government takes office in January. Now is the time for us to try and get those ducks in a row.
PCB Designers: ‘Level Up’ IC, Packaging Knowledge
09/16/2024 | Andy Shaughnessy, Design007 MagazineSoo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.
IPC Releases Newest List of Standards Updates, Revisions
09/16/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.
From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.