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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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IPC Releases Schedule of Standards Development Meetings
August 3, 2016 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries is inviting the industry to join its Standards Development Meetings, which will be held from September 24–30, 2016.
Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by
Attending IPC standards development committee meetings offer attendees opportunities to contribute to the industry standards and guidelines that companies, customers, suppliers and competitors rely on.
IPC Standard Development Committees cover a range of topics, including:
- Assembly & Joining
- Assembly Equipment
- Base Materials
- Cleaning & Coating
- Electronic Documentation Technology
- Electronic Product Data Description
- Embedded Devices
- Environment, Health and Safety
- Fabrication Processes
- Flexible and Rigid-Flex Printed Boards
- High Speed/High Frequency Interconnections
- Management
- Packaged Electronic Components
- Printed Board Design Technology
- Printed Electronics
- Process Control
- Product Assurance
- Product Reliability
- Rigid Printed Boards
- Terms and Definitions
- Testing
For more information or to register, click here.
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