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October 10, 2025 | Zhen Ding TechnologyEstimated reading time: 2 minutes
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported September 2025 revenue of NT$19,362 million, up 32.15% MoM and up 0.13% YoY, marking the second-highest level for the same period in company history. For the third quarter, revenue reached NT$47,366 million, up 23.98% QoQ and down 6.41% YoY; however, in U.S. dollar terms, third-quarter revenue increased by 0.63% YoY. Cumulative revenue for the first three quarters of 2025 totaled NT$125,652 million, up 8.76% YoY, setting an all-time high for the same period.
According to Zhen Ding, September revenue reached the highest level in the first nine months of the year, representing a significant increase from the previous month, as shipments of new products from mobile communication customers progressed smoothly. Meanwhile, revenue from Server/Automotive/Optical and IC Substrate segments both achieved double-digit YoY growth, with each reaching a new monthly record, reflecting the company’s solid progress in diversifying into high-end applications. Looking ahead to the fourth quarter, Zhen Ding expects seasonal demand momentum to remain solid.
Together with sustained order contributions from IC substrates and server/automotive/ optical customers, the company expects that fourth-quarter performance will follow historical seasonal patterns and reach this year’s peak.
Zhen Ding emphasized that as the PCB industry is evolving toward semiconductor-level precision and processes, the company continues to deepen its strategic deployment in AI and high-end applications. It plans to invest over NT$30 billion annually in both 2025 and 2026 to expand high-end PCB capacity, providing comprehensive PCB solutions across rapidly growing AI applications, including servers, optical communications, humanoid robots, and edge AI devices. With robust order momentum from AI servers (including GPU and ASIC platforms) and optical communications, along with rising demand for IC substrates, 2026 is expected to mark a pivotal year as Zhen Ding enters its next stage of growth.
Zhen Ding will make its debut appearance at TPCA Show 2025, taking place from October 22 to 24 at the Nangang Exhibition Center, Hall 1, Booth M-618 (4F). The company will showcase a comprehensive range of PCB and IC substrate solutions covering semiconductors, AI cloud infrastructure, AI edge applications, and next-generation energy. On October 23, Chairman Mr. Charles Shen and President Mr. Jeff Chien will
attend the “Semiconductor × PCB Heterogeneous Integration Summit Forum,” where they will present Zhen Ding’s blueprint for collaboration between the PCB and semiconductor industries under the trend of heterogeneous integration. Together with other industry leaders, they will explore the future landscape of cross-industry integration, demonstrating Zhen Ding’s comprehensive strategic deployment in the AI era.
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