-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
ESI Selects Michael Burger to be Next President and CEO
August 19, 2016 | Globe NewswireEstimated reading time: 2 minutes
Electro Scientific Industries, Inc. today announced that Michael Burger, former CEO of Cascade Microtech, Inc., will join as President and CEO of the Company and will succeed Edward C. Grady on October 3, 2016. Michael will also join the Board of Directors on the same date.
"We are fortunate to have been able to secure the services of Michael Burger as our new President and CEO," said Richard Wills, Chairman of the Board of ESI. "Michael has over 30 years of broad industry and technology leadership experience, most recently as the successful President and CEO of Cascade Microtech Inc.” Prior to his role at Cascade, Michael served as a Board member of Viasystems Inc. following its acquisition of Merix Corporation, where he served as President, Chief Executive Officer and Director. While at Cascade, Michael was recognized as the 2014 Technology Executive of the Year by the Technology Association of Oregon. Wills continued, “We are very pleased to find an executive whose experience in technology is directly applicable to ESI’s strategy to expand in the PCB, ICP and related micromachining markets.”
"I look forward to taking the lead at ESI," said Mr. Burger. "The company has a long history of technology and market leadership. The company has made great progress to get back on a growth and profitability path and I believe we will continue to have many exciting opportunities in the future."
"We continue to be grateful to Ed for his outstanding leadership at ESI, in particular his willingness to step in from the Board of Directors to change the strategic direction and turnaround the financial performance of the company,” continued Mr. Wills. "We are delighted that Ed will continue to make significant contributions and remain on ESI’s Board of Directors."
In connection with his hire, the Compensation Committee of the Board of Directors of the Company approved awards to Mr. Burger of 248,565 performance-based restricted stock units and 229,445 time-based restricted stock units, 76,575 of which were an inducement grant outside of a shareholder-approved plan, all effective his first day of employment. The inducement award will vest 25% on each of the first four anniversaries of his first day of employment. The other terms of Mr. Burger’s compensation will be described in a Current Report on Form 8-K to be filed by the Company.
About ESI, Inc.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Oregon, with global operations and subsidiaries in Asia, Europe and North America. More information is available here.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.