Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
IPC Announces Development of Press-fit Pin Standard for Automotive Requirements
August 23, 2016 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has announced plans to start the development of a new standard intended to cover the qualifications and acceptance requirements for press-fit pin technology that includes the reliability needs for automotive and other industries, such as aerospace.
This new standard is highly anticipated, as there is currently not a specific standard to support press-fit pin automotive requirements and other high-reliability applications. The yet to be named standard is expected to be released late 2017. The IPC standards development process will bring together collaboration between design and assembly task groups as well as all considerations and criteria for applicable documents of both design and assembly.
“This newly proposed standard is exciting for multiple reasons. First, it is a document specifically requested by the European automotive electronics industry and is further evidence that European stakeholders are embracing IPC’s efforts to engage them in IPC’s global standardization process,” said Dave Bergman, IPC vice president of standards and training. “Additionally, it will help to close a technology hole in IPC’s standardization tree by adding a fresh look at the use of press-fit pin technology in electronic hardware.”
This document will be IPC’s second significant standard developed to support the rapidly growing automotive electronics industry. The development of standards continues to be one of the IPC’s core value propositions and the automotive electronics industry is one of the key verticals in Europe.
“IPC views this press-fit pin standard activity as an important step in our mission to deliver value to our growing membership in Europe and to help make them more financially successful,” added Sanjay Huprikar, IPC vice president of member success. “As we continue to utilize our European members as strong voices and champions in the development of our educational offerings and events, we are encouraging these members to get more involved in developing standards for the industry.”
For more information on IPC standards, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Tigo Energy Initiates ‘Made in the USA’ Manufacturing Partnership With EG4 Electronics Share
08/27/2025 | BUSINESS WIRETigo Energy, Inc announced a manufacturing and marketing partnership with EG4 Electronics to produce Tigo optimized inverters and Module Level Power Electronics (MLPE) together with EG4 solar inverters in the United States of America.
North American EMS Industry Shipments Down 4.1% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
SMTA Elects New Board Members
08/27/2025 | SMTAThe SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning October 19, 2025. Elizabeth Benedetto, HP Inc.; Pratish Patel, Electronic Interconnect; and Sutharshan Suppiramaniam, SMT Elite Corporation, have been newly elected to the Board of Directors for the term 2025-2028.