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Ventec International Doubles IMS Material Manufacturing Capacity with $2M Equipment Investment
September 2, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group has doubled its B-series Insulated Metal Substrate (IMS) materials production capacity at its Jiangyin, China facility. The company has invested USD 2 million in leading edge production equipment that boost IMS materials production capacity 100% above prior levels.
Image: Ventec raises production capability & control for IMS production line with increased capacity
To meet the growing demand for high performance IMS materials that deliver an ever-increasing level of thermal performance, reliability and quality, particularly for automotive and other LED lighting and DC power conversion applications, Ventec has invested in new manufacturing equipment at its Jiangyin, China facility. Following a successful initial trial period, the latest production line, which includes a Resin Coater, automated build up, aluminum surface treating equipment, and an inline High Pot Tester, is now fully operational for mass production.
Image: Ventec’s new Resin Coater doubles IMS Materials capacity
Along with the significant capacity expansion, the latest investment also ensures enhanced production capability for Ventec’s VT-4B family of thermally conductive IMS, which deliver an unprecedented level of thermal performance through their established ceramic-filled halogen-free dielectric technology. Multilayered constructions are made possible through resin-coated foil and resin-coated film options.
Image: Thermal Management Solutions & IMS Materials Performance Overview from Ventec
Ventec’s General Manager Jason Chung said the company is on track with its ambitious global growth plan which includes strategic investment in new technologies and production equipment that expand its product offerings and leverage production resources. “With the market need for ever-increasing thermal performance, Vantec’s IMS Materials product pipeline and manufacturing capacity expansion are now well positioned to cost-effectively meet the needs of customers around the globe,” Chung said.
Mark Goodwin, Ventec’s COO Europe & USA, added “the Jiangyin facility’s expanded production capacity positions Ventec to serve as a leading high-volume, high-quality supplier of materials to customers requiring reliable IMS solutions,”.
About Ventec International Group
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
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Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.