-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
iNEMI to Hold Webinar on Assessment of Lead-Free Solder Joint Reliability
September 16, 2016 | iNEMIEstimated reading time: 1 minute
The accelerated testing typically done by industry can be very deceptive unless the results can be counted on to somehow reflect performance in service. As far as lead-free solder joints are concerned, this is more often an issue than commonly recognized. In general, reliability engineers need to know when “best in test” is unlikely to mean “best in service,” how large deviations may be, and which comparisons can be counted on to be conservative.
Binghamton University has recently completed a mechanistically justified model for the thermal fatigue of lead-free solder joints which allows for the generalization of observed trends. Even if not used to predict actual life in service, this model leads to recommendations for test protocols and guidelines.
iNEMI will be holding a research webinar on September 28, 2016, at 11:00 a.m. EDT (North America)/5:00 p.m. CEST (Central Europe), that will review some of the leading issues related to testing lead-free solder joints and discuss the Binghamton University model.
The webinar will be conducted by Dr. Peter Borgesen, Professor of Systems Science & Industrial Engineering and a member of the Materials Science program at Binghamton University. His research focuses on the assessment and optimization of reliability.
This webinar is open to members and non-members, and registration is free. For more information and to register, click here.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.