-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel Offers Free Webinar on Eliminating False Calls with Full Coverage 2D/3D X-ray Inspection
September 21, 2016 | GOEPEL ElectronicEstimated reading time: 2 minutes
Goepel is pleased to announce their upcoming webinar, "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection", to be presented on October 13, 2016 at 11 AM EST.
Those that deal with Automated Optical Inspection (AOI) of solder joints on PCBs are all too familiar with the discussion of false calls rate and test escape rates. Traditional AOI systems work with illumination of varying wavelengths and directions. Depending on the surfaces, the reflections and shadows visible in the camera image are properties used for a pass/fail determination. Changes in the solder resist, differing strong reflections from pins and solder joints as well as flux residue and slight contaminations influence such reflections and shadows – one reason for occurring false calls and escapes.
The webinar illustrates the usage of full-coverage X-ray inspection of all solder joints – whether visible or hidden. The result: fewest false calls and escapes. An integrated AOI module in the AXOI system X-Line · 3D handles the inspection of optical properties such as polarity and labelling which are not visible with X-ray.
Furthermore, possibilities and limits of failure detection will be shown in the webinar with many sample images.
As part of the agenda, you will learn more about the benefits of X-ray inspection (AXI) in comparison with Automated Optical Inspection (AOI). The possibilities and limits of failure detection for an AXI system will be discussed as well as the benefits of the combination of both inspection methods (AXI and AOI). Failure scenarios on QFN, BGA, THT, SO-IC- and QFP package types will also be covered. System concept of the AXOI system X-Line·3D will be reviewed in detail.
For more information and to register, visit Goepel's "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection" event page.
About GOEPEL electronic
GOEPEL electronic is a technologically leading vendor of professional Automated Optical Inspection systems (AOI), Solder Paste Inspection (SPI) and Automated X-ray Inspection Systems (AXI). A network of branch offices in the UK, China, India and the USA, international distributors and service partners ensures the global availability of the products as well as the on-site support to several hundred system installations. Founded in 1991 and headquartered in Jena, Germany, GOEPEL electronic has currently more than 230 employees and generated revenue of 30 million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronics’ industry award winning products are relied on by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.
Suggested Items
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.