-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel Offers Free Webinar on Eliminating False Calls with Full Coverage 2D/3D X-ray Inspection
September 21, 2016 | GOEPEL ElectronicEstimated reading time: 2 minutes
Goepel is pleased to announce their upcoming webinar, "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection", to be presented on October 13, 2016 at 11 AM EST.
Those that deal with Automated Optical Inspection (AOI) of solder joints on PCBs are all too familiar with the discussion of false calls rate and test escape rates. Traditional AOI systems work with illumination of varying wavelengths and directions. Depending on the surfaces, the reflections and shadows visible in the camera image are properties used for a pass/fail determination. Changes in the solder resist, differing strong reflections from pins and solder joints as well as flux residue and slight contaminations influence such reflections and shadows – one reason for occurring false calls and escapes.
The webinar illustrates the usage of full-coverage X-ray inspection of all solder joints – whether visible or hidden. The result: fewest false calls and escapes. An integrated AOI module in the AXOI system X-Line · 3D handles the inspection of optical properties such as polarity and labelling which are not visible with X-ray.
Furthermore, possibilities and limits of failure detection will be shown in the webinar with many sample images.
As part of the agenda, you will learn more about the benefits of X-ray inspection (AXI) in comparison with Automated Optical Inspection (AOI). The possibilities and limits of failure detection for an AXI system will be discussed as well as the benefits of the combination of both inspection methods (AXI and AOI). Failure scenarios on QFN, BGA, THT, SO-IC- and QFP package types will also be covered. System concept of the AXOI system X-Line·3D will be reviewed in detail.
For more information and to register, visit Goepel's "Farewell to false calls resulting from reflections and shadows! Fast, full-coverage 2D/3D X-ray In-Line Inspection" event page.
About GOEPEL electronic
GOEPEL electronic is a technologically leading vendor of professional Automated Optical Inspection systems (AOI), Solder Paste Inspection (SPI) and Automated X-ray Inspection Systems (AXI). A network of branch offices in the UK, China, India and the USA, international distributors and service partners ensures the global availability of the products as well as the on-site support to several hundred system installations. Founded in 1991 and headquartered in Jena, Germany, GOEPEL electronic has currently more than 230 employees and generated revenue of 30 million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronics’ industry award winning products are relied on by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.