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Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Happy’s Essential Skills: Computer-Aided Manufacturing, Part 2 - Automation Examples
The Sunnyvale, California PCB facility was built in 1981 and had even more factory automation than Palo Alto, California facility did. The many systems it had were:- WIP tracking
- CNC for drilling
- Low-volume robot lamination
- Wastewater treatment process control
- AOI and Electrical Test
- Production scheduling
- Computerized plating and chemical control
- Laboratory automation of chemical analysis
- Inkjet individual board serialization for traceability
Figure 14 shows the overall CIM System Information Flow. This was the first implementation of HP’s automation strategy, “The Manufacturers Productivity Network.”
Figure 14: CIM information flow for the Sunnyvale PCB fabrication facility.
Figure 15 shows four of the automated systems controlled by the CIM network: a) Electroless copper and multilayer desmear line; b) Dual copper-nickel-gold/tin plating lines; c) Automatics chemical analysis, control and dosing; d) Robotic material handling in multilayer lamination.
Figure 15: CIM information network: a) Electroless copper and multilayer desmear line; b) Dual copper-nickel-gold/tin plating lines; c) Automatic chemical analysis, control and dosing; d) Robotic material handling in multilayer lamination.
References
- Industrie 4.0 Smart Manufacturing for the Future
- Introduction to Serial Communications, TalTech Instrumental Software Solutions.
- IEEE Standard Codes
- IEEE-488
- Message Automation & Protocol Simulation (MAPS™), GL Communications, Inc.
- “Semiconductor Productivity at HP,” HP Journal, July 1985.
- SEMI Standard E30, General Equipment Model.
- IPC Status of Standardization; IPC Committee Home Pages.
- Smart IoT Technology for Machine Condition Monitoring, Advantech B&B SMARTWORX
- Hermann, M., Pentek, T., Design Principles for Industrie 4.0 Scenarios, Working Paper No. 01/2015, technische universitat-Dortmund, 2015.
- Industry_4.0, Wikipedia.
- “Computerization comes to Plating,” Metal Finishing Magazine, May, 1978.
- MPN: Alive in Sunnyvale PCB; CIM brochure.
Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn and Gentex. He is the co-editor, with Clyde Coombs, of the recently published Printed Circuit Handbook, 7th Ed. To contact Holden, click here.
Page 3 of 3More Columns from Happy’s Tech Talk
Happy’s Tech Talk #34: Producibility and Other Pseudo-metricsHappy’s Tech Talk #33: Wet Process Management and Control
Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes
Happy’s Tech Talk #31: Novel Ultra HDI Architectures
Happy’s Tech Talk #30: The Analog Computer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs