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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Happy’s Essential Skills: Computer-Aided Manufacturing, Part 2 - Automation Examples
The Sunnyvale, California PCB facility was built in 1981 and had even more factory automation than Palo Alto, California facility did. The many systems it had were:- WIP tracking
- CNC for drilling
- Low-volume robot lamination
- Wastewater treatment process control
- AOI and Electrical Test
- Production scheduling
- Computerized plating and chemical control
- Laboratory automation of chemical analysis
- Inkjet individual board serialization for traceability
Figure 14 shows the overall CIM System Information Flow. This was the first implementation of HP’s automation strategy, “The Manufacturers Productivity Network.”
Figure 14: CIM information flow for the Sunnyvale PCB fabrication facility.
Figure 15 shows four of the automated systems controlled by the CIM network: a) Electroless copper and multilayer desmear line; b) Dual copper-nickel-gold/tin plating lines; c) Automatics chemical analysis, control and dosing; d) Robotic material handling in multilayer lamination.
Figure 15: CIM information network: a) Electroless copper and multilayer desmear line; b) Dual copper-nickel-gold/tin plating lines; c) Automatic chemical analysis, control and dosing; d) Robotic material handling in multilayer lamination.
References
- Industrie 4.0 Smart Manufacturing for the Future
- Introduction to Serial Communications, TalTech Instrumental Software Solutions.
- IEEE Standard Codes
- IEEE-488
- Message Automation & Protocol Simulation (MAPS™), GL Communications, Inc.
- “Semiconductor Productivity at HP,” HP Journal, July 1985.
- SEMI Standard E30, General Equipment Model.
- IPC Status of Standardization; IPC Committee Home Pages.
- Smart IoT Technology for Machine Condition Monitoring, Advantech B&B SMARTWORX
- Hermann, M., Pentek, T., Design Principles for Industrie 4.0 Scenarios, Working Paper No. 01/2015, technische universitat-Dortmund, 2015.
- Industry_4.0, Wikipedia.
- “Computerization comes to Plating,” Metal Finishing Magazine, May, 1978.
- MPN: Alive in Sunnyvale PCB; CIM brochure.
Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn and Gentex. He is the co-editor, with Clyde Coombs, of the recently published Printed Circuit Handbook, 7th Ed. To contact Holden, click here.
Page 3 of 3More Columns from Happy’s Tech Talk
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole VoidsHappy’s Tech Talk #39: PCBs Replace Motor Windings
Happy’s Tech Talk #38: Novel Metallization for UHDI
Happy’s Tech Talk #37: New Ultra HDI Materials
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Happy’s Tech Talk #35: Yields March to Design Rules
Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
Happy’s Tech Talk #33: Wet Process Management and Control