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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Happy’s Essential Skills: Computer-Aided Manufacturing, Part 2 - Automation Examples
Computers Come to Plating[12]: Computers were first applied to PCB manufacturing at HP’s Palo Alto facility in 1974. Figure 12 shows the computer controlled plating system that included hoist (Figure 13) control, current control and monitoring for the plating tanks, chemical replenishment for the plating cells and multiple process sequence recipes (Cu, Sn/Ni, Sn & Au} that HP used for all its different 23,000 separate products.
Figure 11: Process recipe on PC-10 to be downloaded by SECS II and GEM. (Source: HP Journal, July 1985)
Figure 12: Automation diagram of the plating system used at HP’s Palo Alto, California facility. (Source: Metal Finishing Magazine[12])
Figure 13: One of the robot hoists is controlled by the computer system.
CIM environment for the Sunnyvale PCB factory[13]
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More Columns from Happy’s Tech Talk
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole VoidsHappy’s Tech Talk #39: PCBs Replace Motor Windings
Happy’s Tech Talk #38: Novel Metallization for UHDI
Happy’s Tech Talk #37: New Ultra HDI Materials
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Happy’s Tech Talk #35: Yields March to Design Rules
Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
Happy’s Tech Talk #33: Wet Process Management and Control