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Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
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In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication.
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New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
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Happy’s Tech Talk
Column from: Happy Holden
Happy Holden is the retired director of electronics and Innovations for Gentex Corporation. He is the former chief technical officer for the world’s largest PCB fabricator, Hon Hai Precision Indus-tries (Foxconn). Prior to that, Happy was the senior PCB technologist for Mentor Graphics and the advanced technology manager at Nan Ya/Westwood Associates and Merix. He previously worked at Hewlett-Packard for over 28 years as director of PCB R&D, CIM Product Marketing and PCB manufacturing engineering manager. He has been involved in advanced PCB technologies for over 50 years.
He is currently a contributing technical editor to I-Connect007 and recently published his 24 Essential Skills for Engineers book which can be found in the I-007eBooks library.