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AIM to Participate at the IMAPS International Symposium
September 26, 2016 | AIMEstimated reading time: 1 minute
AIM will highlight their full range of specialty joining materials at the IMAPS 49th International Symposium on Microelectronics, scheduled to take place October 11-13th, 2016 at the Pasadena Convention Center in Pasadena, California. AIM will be located in booth 810.
AIM’s full range of specialty joining materials includes indium and gold/tin solders for assembly and a wide variety of indium alloys for various applications. AIM’s Specialty Division offers solders for fiber to ferrule soldering, laser die attach, hermetic packaging and sealing, thermal management, and for numerous other applications.
“We are looking forward to participating at this year’s IMAPS International Symposium,” said Brian O’Neill, AIM’s Specialty Materials Manager. “We are anticipating a great show and countless opportunities to connect and provide support to prospective and current AIM customers in the area.”
To discover all of the products AIM’s Specialty Division offers, including indium and lead-free solders, visit the company in booth number 810 at the IMAPS International Symposium.
To learn more about AIM Specialty Division, click here.
About AIM Specialty Division
AIM manufactures and supplies solder and braze materials for the electronic, microwave, semiconductor, LED, and photonic industries. Our innovative products and technical support helps our customers to achieve the highest quality and yields in their production processes.
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