Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
AIM to Participate at the IMAPS International Symposium
September 26, 2016 | AIMEstimated reading time: 1 minute
AIM will highlight their full range of specialty joining materials at the IMAPS 49th International Symposium on Microelectronics, scheduled to take place October 11-13th, 2016 at the Pasadena Convention Center in Pasadena, California. AIM will be located in booth 810.
AIM’s full range of specialty joining materials includes indium and gold/tin solders for assembly and a wide variety of indium alloys for various applications. AIM’s Specialty Division offers solders for fiber to ferrule soldering, laser die attach, hermetic packaging and sealing, thermal management, and for numerous other applications.
“We are looking forward to participating at this year’s IMAPS International Symposium,” said Brian O’Neill, AIM’s Specialty Materials Manager. “We are anticipating a great show and countless opportunities to connect and provide support to prospective and current AIM customers in the area.”
To discover all of the products AIM’s Specialty Division offers, including indium and lead-free solders, visit the company in booth number 810 at the IMAPS International Symposium.
To learn more about AIM Specialty Division, click here.
About AIM Specialty Division
AIM manufactures and supplies solder and braze materials for the electronic, microwave, semiconductor, LED, and photonic industries. Our innovative products and technical support helps our customers to achieve the highest quality and yields in their production processes.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.