-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ACE Offers Unique BGA Cleansing Processing with World-class Coplanarity
September 27, 2016 | ACE Production Technologies Inc.Estimated reading time: 1 minute

ACE Production Technologies, Inc. is pleased to announce that its component lead tinning services operation offers BGA cleansing with unmatched coplanarity.
“Many of our high reliability and military/aerospace customers need to remove the original BGA solder balls prior to converting BGA devices from RoHS to tin-lead or from tin-lead to lead-free,” said Roger Cox, Operations Manager of ACE Component Services. “The ideal method for doing this is the use of a special dynamic side wave process in combination with a nitrogen blow-off which has a significant advantage of minimizing the accumulation of molten solder.”
The de-balling process typically consists of the complete removal of the original BGA solder spheres and pad finish prior to other process steps including site preparation and placement of new solder spheres followed by reflowing to restore the BGA devices to their original specification or for conversion. Additional process steps can also include optical inspection of sphere condition, ball shear or XRF testing, ionic cleanliness and solderability testing.
“Due to the excellent repeatability of the ACE LTS lead tinning machines and its robotic presentation of the BGA to the molten solder in combination with a special dynamic side wave nozzle specifically for BGA ball cleansing and a heated nitrogen blow-off, we are able to maintain the coplanarity of BGAs within 0.003” (0.075mm),” stated Cox. “Our customers have told us we provide them with cleansed BGAs that are more flat than our competitors and are more consistent from part-to-part.” In addition, ACE Component Services has the ability to retin bottom terminated components such as QFNs and DFNs as small as 3mm x 3mm and with a lead pitch down to 0.5mm. Leaded fine-pitch SMT components such as QFPs can be re-tinned down to 0.012” (0.3mm) lead pitch with bridge free results.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information click here, call 509-924-4898 or email sales@ace-protech.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.