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Alpha to Participate in Pin-in-Paste Seminar Hosted by Mycronic
September 29, 2016 | AlphaEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be demonstrating its products and solutions for Pin-in-Paste processes at the upcoming PiP/THR Seminar organized by Mycronic in Dorset, United Kingdom on Wednesday 5th October.
The one day seminar will enable participants to get to grips with the Pin-in-Paste (also known as Through Hole Reflow) process and will include presentations and practical demonstrations from Alpha, Mycronic, Asscon and Phoenix Contact.
Alpha’s Regional Applications Manager, Alan Plant will provide a comprehensive overview of the fundamentals of the PiP process, and will discuss how Alpha’s range of conventional SAC alloy and low melting point pastes can be used in the process.
Mycronic, the organisers of the event, are a Swedish supplier of world-leading laser mask writers and surface mount technology assembly solutions. With over 30 years’ experience in the electronics industry, Mycronic supports industry leaders in more than 50 countries worldwide.
For more information on the seminar or to sign up for the event please email Olga.Zotova@mycronic.com with your name, address and contact information. To find out more about Alpha products for Pin-in-Paste processes visit the Alpha website.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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