The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
L-3 Introduces MX-8 Electro-Optical/Infrared Imaging System for Lightweight Tactical Airborne Applications
October 3, 2016 | Business WireEstimated reading time: 1 minute
L-3 Communications announced today that its WESCAM division has launched its smallest and lightest electro-optical/infrared (EO/IR) airborne imaging system, the MX-8. The MX-8 is designed for small tactical UAVs, light manned Intelligence, Surveillance and Reconnaissance (ISR) aircraft, and tactical aerostats requiring high-performing imaging solutions. The MX-8 will be on display and available for demonstration at L-3’s exhibit during the 2016 Association of the United States Army (AUSA) Annual Meeting and Exposition being held October 3–5 in Washington, D.C.
“The MX-8 is a key addition to WESCAM’s MX™-Series product line, as it addresses the growing demand for a lightweight, high-fidelity imaging system,” said Michael T. Strianese, L-3’s Chairman and Chief Executive Officer. “Our emphasis on developing advanced technologies that address smaller form factor requirements is reflected in the versatility and precision of this product. We are working every day to align our research and development initiatives with the continually evolving needs of a broad array of global customers.”
The fully digital MX-8 has an installed weight of 15 pounds, or 6.8 kilograms, with a clearance level of less than 11 inches, and is capable of supporting up to four sensors simultaneously. It contains all the geolocation capabilities of L-3’s larger MX™-Series systems and is equipped with an advanced image processing suite that produces real-time image enhancement across all sensors.
L-3 WESCAM is part of the Integrated Sensor Systems (ISS) sector within L-3’s Electronic Systems business segment. The company is a world leader in the design and manufacture of stabilized, multi-spectral imaging systems.
About L-3
Headquartered in New York City, L-3 employs approximately 38,000 people worldwide and is a leading provider of a broad range of communication and electronic systems and products used on military and commercial platforms. L-3 is also a prime contractor in aerospace systems. The company reported 2015 sales of $10.5 billion.
Share on:
Suggested Items
Moog Announces Acquisition of COTSWORKS
07/07/2025 | BUSINESS WIREMoog Inc., a worldwide designer, manufacturer and systems integrator of high-performance precision motion and fluid controls and control systems, announced the acquisition of COTSWORKS Inc., an aerospace and defense fiber optics transceiver component manufacturer, for a purchase price of $63 million.
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.