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Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
July 23, 2025 | I-Connect007Estimated reading time: Less than a minute
In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
In this insightful conversation, Beth dives into the world of encapsulation materials— covering the most widely used types, when and why they are applied, and how their evolution is being shaped by both performance demands and sustainability goals. She highlights this particularly exciting time for innovation in encapsulation, where cutting-edge functionality meets environmentally conscious design.
Whether you’re specifying materials or applying them on the manufacturing floor, Beth’s book is an essential guide for understanding today’s encapsulation strategies.
Explore Beth’s book: The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
Stay tuned for more episodes of On the Line with…, where industry leaders share behind-the-scenes insights into the technologies and trends shaping the future of electronics.
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