-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson EFD Introduces New Precision Fluid Dispensing Guide for Mobile Devices & Wearables
October 20, 2016 | Business WireEstimated reading time: 2 minutes
Nordson EFD, a Nordson company has just released a new guide, “Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing.” It features the innovative dispensing solutions available to help manufacturers meet growing consumer demand for thinner, lighter, and more sophisticated, yet durable electronic devices at lower costs.
The guide covers a number of applications common to the industry, including:
- Display applications such as bonding cover glass to LCDs and OLEDs
- Optical bonding and seal bonding with anisotropic conductive fluids
- Camera module applications such as frame bonding and IR cut filter bonding
- Microspeaker applications such as membrane bonding
- Hydrophobic coating during final assembly
- Conformal coating microchip leads and printed circuit boards (PCBs)
- Soldering RF shields onto MEMS microphones with dispensable solder paste
- Applying thermal compound to heat sinks for central processing units (CPUs)
Nordson EFD provides market-leading dispensing solutions ranging from needle valves that dispense micro-deposits as small as 0.15 mm in diameter to jet valves that meet tight tolerances in terms of precise, repeatable deposit volumes, dimensions, and patterns at speeds up to 1000Hz continuous.
When paired with EFD’s automated dispensing robots, which combine easy-to-use proprietary dispensing software with fully integrated vision systems and up to +/- 0.004 mm positional repeatability, it is possible to optimize production processes.
“At Nordson EFD, we leverage more than 50 years of fluid application knowledge in every precision dispensing solution we develop,” said Rhonda Mitchell, Global Marketing Communications Manager at Nordson EFD. “For the mobile devices and wearables industry, that knowledge results in exceptionally accurate, repeatable dispensing outcomes that meet the stringent requirements necessary to effectively meet consumer demand.”
About Nordson EFD
Nordson EFD designs and manufactures precision fluid dispensing systems for benchtop assembly processes and automated assembly lines. By enabling manufacturers to apply the same amount of adhesive, lubricant or other assembly fluid to every part, every time, EFD dispensing systems are helping companies in a wide variety of industries increase throughput, improve quality, and lower their production costs. Other fluid management capabilities include high-quality syringe barrels and cartridges for packaging one- and two-component materials, along with a wide variety of fittings, couplers and connectors for controlling fluid flow in medical, biopharmaceutical and industrial environments. The company is also a leading formulator of specialty solder pastes for dispensing and printing applications in the electronics industry.
About Nordson Corporation
Nordson engineers, manufactures, and markets differentiated products and systems used for dispensing and processing adhesives, coatings, polymers, sealants and biomaterials; and for managing fluids, testing and inspecting for quality, treating surfaces and curing. These products are supported with extensive application expertise and direct global sales and service. We serve a wide variety of consumer non-durable, consumer durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.