-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Mentor Graphics Launches Xpedition Multi-Board Systems Design Solution
October 24, 2016 | PRNewswireEstimated reading time: 2 minutes

Mentor Graphics Corporation has announced its new Xpedition multi-board systems design solution which enables seamless concurrent multi-discipline team collaboration to efficiently manage increasing system complexity. The Xpedition flow maximizes team efficiency by eliminating redundant effort during the design process, and optimizes product performance and reliability with a data management infrastructure. This ensures data integrity and leverages reusable IP across all boards, connectors, and cables in the system.
Designing systems that contain multiple interconnected boards (connectors and/or cables) has traditionally been done with separate uncoupled board and cabling projects held together by desktop office tools such as spreadsheets for intra-board connectivity, text files for system element parameters and drawing applications to show block level system structure and hierarchy. The result is poor collaboration between cross-domain design teams; costly intra-system connectivity errors; extensive time-consuming manual validation steps; and restrictive system change rules that prohibit system design optimization. This lack of holistic multi-board system design further impacts the ability to design networks of interconnect electronic systems, commonly known as system-of-systems that are commonly seen in automotive, space/satellites, industrial automation and data center infrastructure.
When designing a leading-edge, high-performance lithography system, with dozens of multidisciplinary teams working in parallel, we face the challenge of ensuring the consistency and correctness of the entire design to meet our challenging time-to-market goals," said Jan van Vlerken, ASML Senior Director of Electronics Development. "Using Mentor's Xpedition multi-board systems design solution we can design connectivity from the conceptual level down to PCB layout in a single design flow in shorter time, with fewer re-spins, and improved consistency of drawings.
The new Xpedition multi-board systems design flow improves design team productivity and reduces development cost by replacing inefficient paper and manual processes with an automated, fully integrated, collaborative workflow. The automated synchronization between all levels of abstraction and automated connector management will help design teams achieve time-to-market targets. Signal tracing, functional and signal integrity simulation, and design partitioning and re-partitioning while maintaining connectivity content ensures "correct by construction" system design. The new Xpedition flow is a fully parallel collaborative design environment where global teams can work in "real-time," providing companies with the flexibility and intuitive technologies to develop innovative and competitive products.
"The management of electronics connectivity is immensely complex and a key challenge for systems architects today, yet this problem hasn't been adequately addressed previously," stated Laurie Balch, chief analyst, Gary Smith EDA. "Mentor Graphics has a leg-up in the market with its robust solution for multi-board systems development based on its breadth and depth of systems design and analysis technologies."
Suggested Items
Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry
02/20/2025 | SEMISynopsys, Inc. and the SEMI Foundation today announced the signing of a Memorandum of Understanding (MoU) at Synopsys’ corporate headquarters in Sunnyvale, Calif. to advance workforce development within the semiconductor chip design sector.
New EDA Tool Company Embraces AI and Code
02/19/2025 | I-Connect007 Editorial TeamAt DesignCon 2025, we met with Duncan Haldane, CEO and co-founder of the EDA software company JITX, based in Berkeley and San Jose, California. This PCB design tool runs on AI and software code, which Duncan says can accelerate your design cycle by up to 25x. We asked Duncan to explain how this software came to be, how it works, and what this could mean to the future of PCB design.
Arteris Revolutionizes Semiconductor Design with FlexGen
02/19/2025 | Globe NewswireArteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.
Altair Releases Altair HyperWorks 2025
02/19/2025 | AltairAltair, a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design and simulation platform for solving the world's most complex engineering challenges.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.