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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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October 31, 2016 EPA CDR Reporting Applies to Many Manufacturers
October 25, 2016 | IPCEstimated reading time: 1 minute
The deadline for complying with the U.S. Environmental Protection Agency (EPA) Chemical Data Reporting (CDR) rule is October 31, 2016.
Under EPA interpretation of the CDR regulations, manufacturers who send byproducts, such as wastewater treatment sludge, spent etchant or spent baths, for recycling may be required to report under the CDR because EPA views the byproduct stream as a new chemical because it is a feedstock to the recycling process. The applicability of the CDR reporting requirements depends on a number of factors including the amounts of specific chemicals in the byproduct.
For example, any printed circuit board manufacturer using ammonium chloride etchant in excess of approximately 784 gallons per year during 2102, 2013, 2014, or 2015 and sending the spent etchant for recycling is likely to exceed the 2,500 lb. reporting threshold for copper tetraammine chloride.
Recently, IPC achieved a long-sought goal with the inclusion of a requirement for EPA to reexamine this rule passage as part of the of The Frank R. Lautenberg Chemical Safety for the 21st Century Act amending TSCA, however this does not change the need to report this year.
For more information, please review our CDR guidance and TSCA CDR website. You may also contact Fern Abrams, IPC director of regulatory affairs at FernAbrams@ipc.org or +1 202 661-8092.
Suggested Items
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.