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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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October 31, 2016 EPA CDR Reporting Applies to Many Manufacturers
October 25, 2016 | IPCEstimated reading time: 1 minute
The deadline for complying with the U.S. Environmental Protection Agency (EPA) Chemical Data Reporting (CDR) rule is October 31, 2016.
Under EPA interpretation of the CDR regulations, manufacturers who send byproducts, such as wastewater treatment sludge, spent etchant or spent baths, for recycling may be required to report under the CDR because EPA views the byproduct stream as a new chemical because it is a feedstock to the recycling process. The applicability of the CDR reporting requirements depends on a number of factors including the amounts of specific chemicals in the byproduct.
For example, any printed circuit board manufacturer using ammonium chloride etchant in excess of approximately 784 gallons per year during 2102, 2013, 2014, or 2015 and sending the spent etchant for recycling is likely to exceed the 2,500 lb. reporting threshold for copper tetraammine chloride.
Recently, IPC achieved a long-sought goal with the inclusion of a requirement for EPA to reexamine this rule passage as part of the of The Frank R. Lautenberg Chemical Safety for the 21st Century Act amending TSCA, however this does not change the need to report this year.
For more information, please review our CDR guidance and TSCA CDR website. You may also contact Fern Abrams, IPC director of regulatory affairs at FernAbrams@ipc.org or +1 202 661-8092.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.