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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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ECWC14 Invites Submission of Tech Papers for Presentation
October 31, 2016 | EIPCEstimated reading time: 1 minute
The 14th Electronic Circuits World Convention will be held in KINTEX, Goyang City, South Korea from April 25–27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) as well as World Electronic Circuits Council (WECC).
This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.
In line with this, the ECWC14 invites submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:
Management
- Market Trends and Outlook
- Supply Chain Management (SCM)
- M3 Standard, Certification and Qualifications
- M4 Environment, Health and Safety (EHS)
- M5 Business Strategy
Technology
- Materials and Components
- Design and Data Transfer
- Test and Reliability
- Processes, Chemical and Physical
- HDI / Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit
- Application Specific Circuits
- Packaging/Substrate Technology
- SMT and Assembly
- Emerging Technologies
Please visit ECWC section on KPCA English website
www.kpca.or.kr/kr/eng/main.php to submit the abstract.
The ECWC14 is interested in papers as well as posters.
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