Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMT Hautes Technologies Selects Mirtec for Leading-edge 3D AOI Technology
November 14, 2016 | MirtecEstimated reading time: 1 minute
Mirtec has announced that SMT Hautes Technologies has selected its award winning MV-7 OMNI as their future 3D AOI platform of choice.
"SMT Hautes Technologies has earned a solid reputation for the assembly of highly complex circuits requiring high standards of quality and short manufacturing lead times. We offer our customers a wide variety of services ranging from prototype to high production volume. SMT Hautes maintains its technological edge over the competition by combining unparalleled manufacturing expertise with leading-edge equipment technology. In an effort to increase both quality and productivity and reduce manufacturing costs SMT Hautes set out to purchase a robust, post reflow 3D AOI solution with the industry's lowest false call rate. After extensive research, we determined that no other AOI vendor could match the performance and speed of MIRTEC’s MV-7 OMNI 3D AOI machine. The MV-7 OMNI has proven to be the perfect fit for our SMT inspection needs," said Stéphane Deschênes, PDG/CEO of SMT Hautes Technologies.
"We at MIRTEC understand that electronic manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much needed competitive edge in this highly competitive industry," said Brian D'Amico, president of Mirtec Corp. "With this in mind, an increasing number of manufacturers are relying upon 3D automated optical inspection (AOI) equipment to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded SMT Hautes Technologies' 3D AOI business. We look forward to a long and prosperous relationship between our two organizations."
Mirtec's award-winning MV-7 OMNI 3D AOI machines are configured with its exclusive OMNI-VISION 3D Inspection System, which combines 15 Mega Pixel CoaXPress Camera Technology with Mirtec's revolutionary Digital Multi-Frequency Quad Moiré 3D System to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured, the MV-7 OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
About Mirtec
Mirtec is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please click here.
For more information about SMT Hautes Technologies, please click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.