Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible

07/09/2026 | Barry Olney -- Column: Beyond Design
As data rates climb from 112G PAM4 toward 224G PAM4 and beyond, electronics designers are discovering that traditional stripline and microstrip geometries are no longer sufficient. The physics simply break. Rise times are now in the single‑digit picosecond range, loss budgets are measured in millimeters, and even tiny discontinuities can collapse a PAM4 eye.

Netomnia Selects VIAVI Remote Fiber Test System to Accelerate Network Expansion in the UK VIAVI Solutions

06/24/2025 | PRNewswire
VIAVI Solutions Inc. announced that alternative network (Alt-Net) operator Netomnia has chosen VIAVI's ONMSi Remote Fiber Test System (RFTS) to simplify and accelerate network installation and ongoing maintenance as the company rapidly expands its business in the UK.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

12/23/2024 | Anaya Vardya, American Standard Circuits
​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/20/2024 | Nolan Johnson, I-Connect007
Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week. 

Understanding Cleaning Challenges for Automated Solder Paste Dispensing

09/18/2024 | Debbie Carboni, KYZEN
In today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in