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IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging

04/09/2025 | Tracy Riggan, IPC
The IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.

Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary

03/28/2025 | Zollner Elektronik AG
In a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.

Weak Consumer Market Dampens Enterprise SSD Price Growth, 4Q24 Supplier Revenue Declines 0.5%

03/07/2025 | TrendForce
TrendForce’s latest research shows that 4Q24 enterprise SSD demand remained stable compared to the previous quarter, driven by the arrival of NVIDIA H-series products and continued procurement from large CSPs in China.

Yamaha Motor to Launch New YRP10e Entry-Level Solder Paste Printer

02/26/2025 | Yamaha Motor Europe Robotics, SMT Section
Yamaha Motor Europe Robotics SMT Section announces that it will release the new YRP10e solder paste printer  on April 1 of this year.

EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability

02/19/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.
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