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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 20, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Which reminds me: If you’re not a subscriber to our Daily Newsletter, I encourage you to go to my I-Connect007 right now and subscribe. It’s free, and you can choose all the targeted content you want, from magazines to newsletters. You won’t regret it.
It’ll be 2025 soon enough, so I close out this year wishing you all a wonderful holiday season.
Automotive PCB Market Share to Rise at 5.4% CAGR, to Reach $16.43 Billion by 2034
Published December 18
The report establishes that:
- The market for automotive PCB is driven by a notable rise in electrification and modernization of vehicles.
- The double-sided PCB segment is expected to experience the highest CAGR during the forecast period.
There is more in the report that is well worth a review.
Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components
Published December 13
As most of us know, Bosch is a tier 1 automotive supplier. This proposed $225 million investment would support Bosch’s planned $1.9 billion investment in its in Roseville, California facility, which produces silicon carbide (SiC) power semiconductors. This proposed expansion of this, Bosch’s largest SiC device factory would increase production capacity, create up to 1,000 construction jobs and up to 700 manufacturing, engineering, and research and development jobs in California.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
Published December 17
Ventec continues expanding manufacturing outside China. This $17 million Thai facility will be built on 8.4 acres in the Hi-Tech Industrial Estate in the Ayutthaya province north of Bangkok. This project would seem to reinforce Ventec’s commitment to global supply chain resiliency, and customer proximity in the developing Southeast Asia PCB manufacturing hub.
Sayonara to the Last Standing Copper Foil Plant in North America
Published December 17
The U.S. is now faced with the closure of the last standing copper foil manufacturing plant in North America serving the PCB fabrication industry and supporting many U.S. military and defense products. Undoubtedly this will cause a ripple within the U.S. supply chain. Read more of Marcy LaRont’s analysis here.
EMI Shielding Market worth $9.69 Billion in 2029
Published December 19
What’s creating this sort of growth in EMI shielding? The report stipulates that pressure to meet strict EMC standards has increased regulatory requirements, and the emergence of connected and smart devices has sharply increased the demand for advanced shielding materials.Just another reminder that the electronics industry continues to morph into a holistic design-and-manufacture operational model. To my point, EMI shielding used to be effectively a mechanical design consideration; increasingly, it needs to be specified during board design.
Suggested Items
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
L3Harris Receives Contract to Develop Next-Generation Security Processor for US Government
06/02/2025 | L3Harris TechnologiesL3Harris Technologies has been awarded a contract by the U.S. government to develop a next-generation security processor to secure communication devices across the globe.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session
05/23/2025 | Compal Electronics Inc.As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.
TT Electronics' Cleveland Ohio Facility Re-Certified to Aerospace and Defence Standards AS9100 and Nadcap
05/23/2025 | TT ElectronicsTT Electronics has successfully completed recertification of the Cleveland facility to AS9100 and Nadcap standards. This milestone underscores the company’s unwavering dedication to quality in manufacturing for the aerospace and defence sectors, a commitment proudly upheld for more than 15 years.