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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 20, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Which reminds me: If you’re not a subscriber to our Daily Newsletter, I encourage you to go to my I-Connect007 right now and subscribe. It’s free, and you can choose all the targeted content you want, from magazines to newsletters. You won’t regret it.
It’ll be 2025 soon enough, so I close out this year wishing you all a wonderful holiday season.
Automotive PCB Market Share to Rise at 5.4% CAGR, to Reach $16.43 Billion by 2034
Published December 18
The report establishes that:
- The market for automotive PCB is driven by a notable rise in electrification and modernization of vehicles.
- The double-sided PCB segment is expected to experience the highest CAGR during the forecast period.
There is more in the report that is well worth a review.
Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components
Published December 13
As most of us know, Bosch is a tier 1 automotive supplier. This proposed $225 million investment would support Bosch’s planned $1.9 billion investment in its in Roseville, California facility, which produces silicon carbide (SiC) power semiconductors. This proposed expansion of this, Bosch’s largest SiC device factory would increase production capacity, create up to 1,000 construction jobs and up to 700 manufacturing, engineering, and research and development jobs in California.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
Published December 17
Ventec continues expanding manufacturing outside China. This $17 million Thai facility will be built on 8.4 acres in the Hi-Tech Industrial Estate in the Ayutthaya province north of Bangkok. This project would seem to reinforce Ventec’s commitment to global supply chain resiliency, and customer proximity in the developing Southeast Asia PCB manufacturing hub.
Sayonara to the Last Standing Copper Foil Plant in North America
Published December 17
The U.S. is now faced with the closure of the last standing copper foil manufacturing plant in North America serving the PCB fabrication industry and supporting many U.S. military and defense products. Undoubtedly this will cause a ripple within the U.S. supply chain. Read more of Marcy LaRont’s analysis here.
EMI Shielding Market worth $9.69 Billion in 2029
Published December 19
What’s creating this sort of growth in EMI shielding? The report stipulates that pressure to meet strict EMC standards has increased regulatory requirements, and the emergence of connected and smart devices has sharply increased the demand for advanced shielding materials.Just another reminder that the electronics industry continues to morph into a holistic design-and-manufacture operational model. To my point, EMI shielding used to be effectively a mechanical design consideration; increasingly, it needs to be specified during board design.
Suggested Items
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.
Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary
03/28/2025 | Zollner Elektronik AGIn a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.
Weak Consumer Market Dampens Enterprise SSD Price Growth, 4Q24 Supplier Revenue Declines 0.5%
03/07/2025 | TrendForceTrendForce’s latest research shows that 4Q24 enterprise SSD demand remained stable compared to the previous quarter, driven by the arrival of NVIDIA H-series products and continued procurement from large CSPs in China.
Yamaha Motor to Launch New YRP10e Entry-Level Solder Paste Printer
02/26/2025 | Yamaha Motor Europe Robotics, SMT SectionYamaha Motor Europe Robotics SMT Section announces that it will release the new YRP10e solder paste printer on April 1 of this year.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.