-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
PNC Invests in Heller's SMT Reflow Oven
November 15, 2016 | PNC Inc.Estimated reading time: 2 minutes
PNC Inc. recently purchased a 1913 Mark III Series SMT Reflow Oven from Heller Industries. In keeping with their commitment to continuous improvement, this machine will be a part of a new SMT line that is coming to PNC in the coming weeks.
"Although we have positioned ourselves as industry leaders, we still want to keep pushing the envelope,” said President Sam Sangani. "We recognize there is no cap on quality so pursuing it is an ongoing endeavor."
The 1913 Mark III is a 13-zone (more than any competitor) reflow machine that is capable of moving as fast as 1.4m/min thus lending itself well to PNC Inc.'s increasing PC board assembly demands. Also, it has a 26-inch wide heater module along with a wide process window which makes it a very versatile tool.
With RoHs becoming more and more prevalent in the industry, the 1913 Mark III is one of the most efficient reflows on the market to date. Its innovative cooling module allows for cooling rates higher than 3 degrees C per second—enabling it to meet the most stringent of lead-free requirements.
"Above all," Sangani said, "was our insistence that this machine be cost efficient for our customers' benefit and energy efficient for the environment's benefit." This reflow can save up to $40,000 per year—these savings will undoubtedly transfer to customers and their bottom lines.
About PNC Inc.
PNC Inc. is located in Nutley, N.J. and is one of the country’s leading providers of Rigid, Rigid-Flex and Flex Printed Circuit Boards and the largest of their in their region. They are committed to providing their customers with innovative solutions for their PCB design, fabrication and assembly and are committed to working side-by-side with visionary engineers and buyers in all technologies including—but not limited to—High Frequency RF/Microwave boards, audio, defense, aerospace and medical. They combine the latest technology with their decades of experience to deliver world class printed circuit board solutions to their customers.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.