Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
FKN Systek Enables Clean and Safe PCB Depaneling
December 5, 2016 | FKN SystekEstimated reading time: Less than a minute
FKN Systek has released a table top cut-off saw to use in singulating PCB panels up to 12” long. The S100 saw provides a low stress method to singulate panels and backplanes with sensitive surface mount components close to the edge of the parting section. The operator places the PCB to be singulated onto the positioning rails of a linear bearing guided table, and moves the table with the panel forward to make a smooth clean cut. The system features adjustable guide blades underneath the scoreline, making board alignment quick and easy.
Also, the PCB depaneling saw allows cutting depth to be set to just cut through the PCB itself. Any components which overhang the parting line will remain intact. A built-in dust extraction plenum around the saw blade pulls particles out of the environment into a HEPA filter. An additional clean up vacuum wand can be switched on as desired to remove any dust build up on the PCB edges.
The tool features a diamond saw blade measuring 2.95” (75mm) in diameter. It can cut boards up to 0.25” (6.35 mm) thick.
Share on:
Suggested Items
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.