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FKN Systek Enables Clean and Safe PCB Depaneling
December 5, 2016 | FKN SystekEstimated reading time: Less than a minute
FKN Systek has released a table top cut-off saw to use in singulating PCB panels up to 12” long. The S100 saw provides a low stress method to singulate panels and backplanes with sensitive surface mount components close to the edge of the parting section. The operator places the PCB to be singulated onto the positioning rails of a linear bearing guided table, and moves the table with the panel forward to make a smooth clean cut. The system features adjustable guide blades underneath the scoreline, making board alignment quick and easy.
Also, the PCB depaneling saw allows cutting depth to be set to just cut through the PCB itself. Any components which overhang the parting line will remain intact. A built-in dust extraction plenum around the saw blade pulls particles out of the environment into a HEPA filter. An additional clean up vacuum wand can be switched on as desired to remove any dust build up on the PCB edges.
The tool features a diamond saw blade measuring 2.95” (75mm) in diameter. It can cut boards up to 0.25” (6.35 mm) thick.
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Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.