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FKN Systek Enables Clean and Safe PCB Depaneling
December 5, 2016 | FKN SystekEstimated reading time: Less than a minute
FKN Systek has released a table top cut-off saw to use in singulating PCB panels up to 12” long. The S100 saw provides a low stress method to singulate panels and backplanes with sensitive surface mount components close to the edge of the parting section. The operator places the PCB to be singulated onto the positioning rails of a linear bearing guided table, and moves the table with the panel forward to make a smooth clean cut. The system features adjustable guide blades underneath the scoreline, making board alignment quick and easy.
Also, the PCB depaneling saw allows cutting depth to be set to just cut through the PCB itself. Any components which overhang the parting line will remain intact. A built-in dust extraction plenum around the saw blade pulls particles out of the environment into a HEPA filter. An additional clean up vacuum wand can be switched on as desired to remove any dust build up on the PCB edges.
The tool features a diamond saw blade measuring 2.95” (75mm) in diameter. It can cut boards up to 0.25” (6.35 mm) thick.
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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
Talking with Tamara: Floor Planning Policies
09/04/2025 | Andy Shaughnessy, Design007 MagazineTamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.