Qualcomm Leads Global Ranking of Top 10 Fabless IC Design Companies
December 6, 2016 | TrendForceEstimated reading time: 2 minutes
Qualcomm CDMA Technologies (abbreviation QCT, here referred to as Qualcomm) tops the projected ranking of the top 10 fabless IC design houses worldwide based on annual revenues for 2016, according to TrendForce’s analysis. Broadcom Limited is expected to be runner-up, while MediaTek will take third place. The ranking positions of these three companies are fairly secure in the short term because collectively they would represent about 65% of the total revenue generated all the design houses that are listed on this year’s top 10 ranking.
TrendForce finds that changes in the top 10 ranking between 2015 and 2016 were mainly attributed to mergers and acquisitions. The IC supplier formerly known as Avago climbed to second place in this year’s ranking by acquiring Broadcom Corporation. Avago also subsequently operates under the new name Broadcom Limited. The deal has allowed other companies to move up in the ranking.
Taiwan’s MediaTek took third place in this year’s ranking as the company’s acquisition of four compatriot IC design houses gave it a much wider lead in revenue over the following seven companies in the ranking. Realtek, another Taiwan-based design house is expected to become one of the top 10 this year with its annual revenue growth at a high of 22.5%.
Among this year’s top 10 IC design houses by revenue, MediaTek, NVIDIA, AMD, Xilinx and Realtek are expected to register annual growth. MediaTek’s annual revenue growth is estimated at 17.6% this year as the company has expanded via acquisitions and profited from strong demand from Chinese smartphone brands. NIVIDIA, which has established itself in the gaming market during recent years, is also benefitting from revenue increases in areas such as data centers and automotive electronics. As for AMD, the company has successes in developing its semi-custom chip business and is gradually expanding into the embedded and enterprise markets. These three areas contributed to significant revenue increase for AMD this third quarter and are likely to become important market segments for the company in the near future.
Qualcomm, Broadcom, Marvell, Novatek and Dialog are expected to post annual revenue declines in 2016, based on TrendForce’s projection. In addition to fending off competition from MediaTek, Qualcomm this year faces growing challenges from large Chinese IC design houses. HiSilicon and Spreadtrum for example have made significant progress in catching up technologically. Moreover, HiSilicon is supplying more chips to its group company Huawei. Qualcomm was also affected by the discontinuation of Samsung’s flagship smartphone Galaxy Note 7.
Broadcom Limited’s revenue decline was caused by the sale of its Wireless Internet of Things business to the semiconductor company Cypress. Novatek on the other hand has seen its revenue growth retreats as the global consumer electronics market reach a growth plateau.
TrendForce further notes that the two major Chinese fabless IC design houses HiSilicon and Spreadtrum have not released their financial results to the public. For that reason, these two companies are excluded from TrendForce’s 2016 ranking. Nonetheless, TrendForce’s analysis indicates that HiSilicon and Spreadtrum are expected to do well revenue-wise this year on account of the strong growth in China’s smartphone market. HiSilicon’s annual revenue for 2016 is estimated around US$3.98 billion, an increase of 11.8% from 2015. Spreadtrum’s revenue for this year is estimated around US$1.91 billion, translating to an annual growth of 8.1%.
Suggested Items
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
05/13/2025 | Jesse Vaughan -- Column: Beyond the BoardThe electronics industry is at the heart of technological progress, driving innovative advancements that shape our world. Yet, despite the sector's rapid evolution, it faces a looming challenge: attracting and retaining young talent. With an aging workforce and an increasing demand for skilled professionals, the industry must find ways to inspire the next generation of innovators.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.