Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Orbotech Presents Best-in-Class Industry 4.0-Compliant PCB Production Solutions at HKPCA 2016
December 7, 2016 | OrbotechEstimated reading time: 1 minute
Orbotech Ltd., a leading provider of process innovation technologies, solutions and equipment that are enabling the transformation of the global electronics manufacturing industry, is showcasing a selection of its most innovative Industry 4.0-compliant production solutions for PCB manufacturers at this year’s HKPCA show. For the first time in China, Orbotech will be holding live demos of its Sprint™ 200 Legend Inkjet Printer, designed to replace silk screen printing, and Discovery™ II 9200 AOI solution, both with ultra-fast automation for mass production environments.
Orbotech will also present other cutting-edge PCB production yield optimizing solutions including the Precise™ 800 Automated Optical Shaping (AOS) solution, Diamond™ 8 DI solution for solder mask and InCAM® Flex and InPlan® Flex PCB design and production planning software.
You can see live demos of Orbotech’s industry leading PCB manufacturing solutions at HKPCA 2016, from December 7-9 2016, in Hall 1, Booth J11, Shenzhen Convention & Exhibition Center, Shenzhen, China.
“Orbotech customers in the Pacific Rim know what it means to lead in the PCB market,” remarked Mr. Arik Gordon, Corporate Vice President and President of Orbotech’s PCB Division. “That’s why we constantly bring the most advanced innovations to the industry. In addition to our increasingly precise and flexible solutions that reduce scrap and increase yield, Orbotech’s Industry 4.0 compliant solutions now help our PCB manufacturing customers to further improve productivity and be more responsive to production issues in real time.”
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems(MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com/ and www.spts.com/
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.