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Currently, for electronic assemblies to operate at high temperature, they must use a high lead solder or expensive gold based solder. In line with this, the UK's National Physical Laboratory (NPL) is being partnered with several end-users to better characterize alternatives for high temperature component interconnect to operate above 200°C. NPL has been part of a consortia to successfully develop innovative materials specifically designed to offer a Pb-free cost-effective alternative.
In addition to this, NPL is also holding a technical webinar, with the theme Characterization of High Temperature Component Interconnect Materials, on 10 January 2017, to be presented by Martin Wickham.
This presentation summarizes the work undertaken by the authors to develop and better understand this new family of electrical interconnection materials including updated long-term reliability data. The project brought together a materials supplier (GEM - Gwent Electronic Materials), an end-user (MSL - Microsemi), and a technology research organization (NPL) to jointly develop, test and implement in production, the solution based on silver-loaded silicone materials.
This presentation focuses on the testing and materials evaluation undertaken at NPL to determine the long-term performance of these alternative materials including high temperature ageing up to 300°C, thermal cycling and damp heat testing. Details of the shear strength and electrical performance of interconnects between the substrates and components during the test regimes are given. The manufacturing process is outlined, including details of the test vehicles utilized. The processing temperature for the conductive adhesive is 250 °C, which offers additional advantages in potential improvements in component and substrate reliability compared to soldered solutions, which would typically be processed at temperatures above 300°C.
Topics covered include:
- High temperature materials and applications
- Development of materials for HT
- Reliability results from two projects
- Long-term high temperature storage and mechanical testing
- Design issues and process failures
- Future requirements and testing
This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.
For more information or to register, click here.
