Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends
December 19, 2016 | Real Time With... HKPCA & IPC Show 2016Estimated reading time: Less than a minute
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri, business development manager at Rogers Corp., speaks with I-Connect007's Stephen Las Marias about the 5G trend and how it will impact the materials requirements.
He also talks about the thermal management, and how their ML series of laminates is helping customers in the automotive, LED lighting and consumer electronics space address issue.
Share on:
Suggested Items
System Basis Chip Market Size Worth USD 66.30 Billion by 2032, at a CAGR of 11.40%
07/18/2025 | Globe NewswireAccording to the SNS Insider, “The System Basis Chip Market was valued at USD 25.10 billion in 2023 and is projected to reach USD 66.31 billion by 2032, growing at a CAGR of 11.40% from 2024 to 2032”.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Japan's Car Industry Has Highest Robot Installations in Five Years
07/15/2025 | IFRThe Japanese automotive industry installed a total of about 13,000 industrial robots in 2024. This is an 11% increase compared to the previous year and the highest level recorded since 2020.
GlobalLogic, Volvo Cars Deepen Collaboration to Engineer the Future of Mobility
07/09/2025 | GlobalLogicGlobalLogic Inc., a Hitachi Group Company and leader in digital engineering, has announced it has been selected in Volvo Cars’ partnership ecosystem as one of the strategic partners within engineering services globally.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in