Silver Nanowire Inks Enable Paper-based Printable Electronics
January 4, 2017 | Duke UniversityEstimated reading time: 3 minutes
By suspending tiny metal nanoparticles in liquids, Duke University scientists are brewing up conductive ink-jet printer "inks" to print inexpensive, customizable circuit patterns on just about any surface.
Duke University chemists have found that silver nanowire films like these conduct electricity well enough to form functioning circuits without applying high temperatures, enabling printable electronics on heat-sensitive materials like paper or plastic. (Image: Ian Stewart and Benjamin Wiley)
Printed electronics, which are already being used on a wide scale in devices such as the anti-theft radio frequency identification (RFID) tags you might find on the back of new DVDs, currently have one major drawback: for the circuits to work, they first have to be heated to melt all the nanoparticles together into a single conductive wire, making it impossible to print circuits on inexpensive plastics or paper.
A new study by Duke researchers shows that tweaking the shape of the nanoparticles in the ink might just eliminate the need for heat.
By comparing the conductivity of films made from different shapes of silver nanostructures, the researchers found that electrons zip through films made of silver nanowires much easier than films made from other shapes, like nanospheres or microflakes. In fact, electrons flowed so easily through the nanowire films that they could function in printed circuits without the need to melt them all together.
"The nanowires had a 4,000 times higher conductivity than the more commonly used silver nanoparticles that you would find in printed antennas for RFID tags," said Benjamin Wiley, assistant professor of chemistry at Duke. "So if you use nanowires, then you don't have to heat the printed circuits up to such high temperature and you can use cheaper plastics or paper."
"There is really nothing else I can think of besides these silver nanowires that you can just print and it's simply conductive, without any post-processing," Wiley added.
These types of printed electronics could have applications far beyond smart packaging; researchers envision using the technology to make solar cells, printed displays, LEDS, touchscreens, amplifiers, batteries and even some implantable bio-electronic devices. The results appeared online in ACS Applied Materials and Interfaces ("Effect of Morphology on the Electrical Resistivity of Silver Nanostructure Films").
Silver has become a go-to material for making printed electronics, Wiley said, and a number of studies have recently appeared measuring the conductivity of films with different shapes of silver nanostructures. However, experimental variations make direct comparisons between the shapes difficult, and few reports have linked the conductivity of the films to the total mass of silver used, an important factor when working with a costly material.
"We wanted to eliminate any extra materials from the inks and simply hone in on the amount of silver in the films and the contacts between the nanostructures as the only source of variability," said Ian Stewart, a recent graduate student in Wiley's lab and first author on the ACS paper.
Stewart used known recipes to cook up silver nanostructures with different shapes, including nanoparticles, microflakes, and short and long nanowires, and mixed these nanostructures with distilled water to make simple "inks." He then invented a quick and easy way to make thin films using equipment available in just about any lab -- glass slides and double-sided tape.
"We used a hole punch to cut out wells from double-sided tape and stuck these to glass slides," Stewart said. By adding a precise volume of ink into each tape "well" and then heating the wells -- either to relatively low temperature to simply evaporate the water or to higher temperatures to begin melting the structures together -- he created a variety of films to test.
The team say they weren't surprised that the long nanowire films had the highest conductivity. Electrons usually flow easily through individual nanostructures but get stuck when they have to jump from one structure to the next, Wiley explained, and long nanowires greatly reduce the number of times the electrons have to make this "jump".
But they were surprised at just how drastic the change was. "The resistivity of the long silver nanowire films is several orders of magnitude lower than silver nanoparticles and only 10 times greater than pure silver," Stewart said.
The team is now experimenting with using aerosol jets to print silver nanowire inks in usable circuits. Wiley says they also want to explore whether silver-coated copper nanowires, which are significantly cheaper to produce than pure silver nanowires, will give the same effect.
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.