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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

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Take the Mic: Advanced Encapsulation Process with LPMS USA

03/27/2026 | Real Time with... APEX EXPO
Explore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.

LPMS USA Demos New LED Light Giveaway at APEX EXPO 2026

03/02/2026 | LPMS USA
LPMS USA, a leader in low-pressure molding solutions, will exhibit at APEX EXPO 2026, bringing live equipment demonstrations and advanced molding material technologies to the show floor.

LPMS USA and Bostik Announce Joint Technical Webinar on Low Pressure Molding and New Outdoor Electronics Innovation

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LPMS USA, a leader in low-pressure molding solutions, is proud to have partnered with Bostik to host a live technical webinar focused on electronic encapsulation using low-pressure molding and the launch of Bostik’s newest outdoor grade material, Thermelt® 964.

LPMS USA to Offer Live Molding Demos at IPC APEX 2025

02/07/2025 | LPMS USA
LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.

IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
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