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See Ersa’s Versaflex Selective, New HR 550 Rework and Complete APEX Smart Selective Soldering Package in Booth #3111
January 10, 2017 | Kurtz Ersa North AmericaEstimated reading time: 1 minute
Kurtz Ersa North America will exhibit in booth no. 3111 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in California. Ersa will show the VERSAFLEX-Ultra, the award-winning HR 550 Rework system and its complete APEX Professional Selective Soldering Package.
The VERSAFLEX-Ultra selective solder module offers unlimited flexibility, productivity and uncompromising quality – two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles, can work in parallel.
With its revolutionary flexibility, the soldering pots are able to move freely in x-, y- and z-direction. Each soldering pot is completely independent and has no y- or x-dependencies to the other one. An anti-collision software ensures the free movement of the servo-driven axis system of the soldering pots.
The HR 550 hybrid rework system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications. The system features a 1,500 W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly.
The complete APEX Professional Smart Selective Soldering Package consists of the Smartflow combined with its own N2 generator, and uses the same successful and proven Ersa Selective Soldering Technology as the large Ersa VERSAFLOW systems without compromising quality and accuracy. Due to its universal pallet fastening, the Smartflow can handle PCB sizes of up to 508 x 50 8 mm [20” x 20”]. The system is equipped with its own nitrogen generator and is ready to run at the highest quality and repeatability on the market for those customers making the transition from hand soldering to automated selective.
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Sweeney Ng - CEE PCBSuggested Items
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
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