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Industry Veteran Nick Leonardi Joins SMART Microsystems Team
January 19, 2017 | SMART MicrosystemsEstimated reading time: 1 minute
Nicholas Leonardi has been retained by SMART Microsystems in the role of Business Development, bringing over 25 years of industry experience with positions ranging from product development and manufacturing to sales and marketing, in start-ups to the Fortune 100. Mr. Leonardi gained valuable technical sales, marketing and applications management experience with companies such as General Electric and National Semiconductor. The transition to business development followed years in manufacturing and development engineering with companies such as LSI Logic and Advanced Micro Devices. Current industry activities include his participation on the MEPTEC Advisory Board, Arizona State University Bio-Medical Engineering School Advisory Board and memberships with other Electronics Industry Organizations. Mr. Leonardi received a B.S. Degree in Materials Engineering from Alfred University, in New York State.
About SMART Microsystems
SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move your MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of your new MEMS sensor product to the market.
SMART Microsystems has gained momentum and is well positioned in MEMS Packaging and Assembly, supporting demand for next generation sensor related technologies, with focus on Medical, Auto and the Mil/Aero industries.
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Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.