Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017
January 26, 2017 | TopLineEstimated reading time: 1 minute
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
MSC technology and its benefits will be explained and discussed by TopLine’s President, Martin Hart, in the TopLine booth, #923, at the IPC/APEX EXPO 2017 trade show in San Diego, California February 14-16, 2017.
Engineers at NASA's Marshall Space Flight Center initially developed this novel interconnection structure for integrated circuit packages. This innovation replaces traditional CCGA solder columns with the potential to extend life under harsh environments, extreme thermal stress, vibration and shock. The Micro-coil Spring technology provides flexibility in three dimensions between the ceramic (or plastic) package and the PCB board. This technology offers a distinct improvement over cast Pb90/Sn10 solder columns or copper-ribbon-wrapped Pb80/Sn20 solder columns, which have limited flexibility under shear stress. MSC technology offers a novel alternative, providing better flexibility in high temperature and harsh environments.
Micro-coil springs are fabricated from beryllium copper C17200 (Alloy 25) per ASTM B 197. The coils are post-plated with electro-deposited Sn60/Pb40, 100 micro-inches minimum thickness. Micro-coil springs may also be used in place of solder balls on plastic PBGA packages. After reflow at normal tin-lead temperature profiles, Sn63/Pb37 solder paste forms a fillet around the double coil ends of the spring.
To learn more, click here, and visit the TopLine booth #923 at APEX.
About TopLine
TopLine Corporation is a leading provider of test vehicle components and packaging solutions for Circuit Assemblies. TopLine manufactures CCGA Column Grid Arrays, solder columns, and a wide range of daisy chain semiconductor packages. TopLine offers a complete range of daisy chain test chips for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. TopLine is a one-stop source for all dummy components.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.