-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Kyzen's Dr. Mike Bixenman to Present at IPC APEX EXPO 2017
January 30, 2017 | KyzenEstimated reading time: 2 minutes

KYZEN is pleased to announce that Dr. Mike Bixenman will present two papers at the upcoming IPC APEX EXPO at the San Diego Convention Center.
"Electrochemical Methods to Measure the Corrosion Potential of Flux Residues" will be presented during Session S04 on Tuesday, February 14, 2017 from 1:30-3 p.m. The paper was co-authored by David Lober and Anna Ailworth, KYZEN, and Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean and Kyle Loomis from Kester Corporation. The paper entitled, "Does Cleaning the PCB before Conformal Coating Add Value?" will be presented during Session S20 on Wednesday, February 15, 2017 from 1:30-3 p.m. The paper was co-authored by Mark McMeen and Jason Tynes, STI Electronics, and Gustavo Arredondo, ParaTech Coating.
A recent research study of both flux activator systems and cleaning under bottom terminated components found that different no-clean flux packages have chemical properties that induce failure at different rates. The study also found that residues that were not fully cleaned under leadless components could be a reliability risk. Electrochemical methods (EIS) provide insight into the corrosion potential of a residue, in this case, flux residue. Electrochemical methods have not been commonly used for assessing corrosion potential on electronic devices. The purpose of the "Electrochemical Methods to Measure the Corrosion Potential of Flux Residues" research study is to run electrochemical methods on the four flux systems used in the SIR study to determine if EIS data findings have commonality on the SIR data findings.
The purpose of "Does Cleaning the PCB before Conformal Coating Add Value?" is to research the value of cleaning under bottom terminated components before conformal coating. A QFN surface insulation resistance test vehicle, with sensors placed under the component termination will be used for this research. The designed experiment will study both cleaning and non-cleaning before poly-para-xylene coating. These response variables will be measured by: 1) Visual Inspection of Post Soldering Residues, 2) Site Specific Ion Chromatography, and 3) Surface Insulation Resistance using the IPC TM650 2.6.3.7 test method.
Dr. Mike Bixenman, CTO of KYZEN, has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.