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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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IPC Designer’s Council–Orange County Chapter to Hold Lunch 'n Learn Meeting
February 1, 2017 | IPC Designers Council, Orange Co. ChapterEstimated reading time: Less than a minute
The IPC Designers Council–Orange County chapter will be holding a Lunch 'n Learn Meeting on Wednesday, February 8, 2017, at the Clifton C. Miller Community Center in Tustin, California.
The topic to be discussed is “Advanced PCB Laminate Material Selection”, which focuses on what a designer needs to know about choosing the right material for your design. Speakers include Michael Gay, Director, High Performance Products, at Isola Laminate Group, and Dan Diesel, Chief Information Officer and Business Strategist, at Insulectro.
For more information or to register, click here.
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Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
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The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.