-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
MacDermid Enthone's Neil Bolding and Flex's Weifeng Liu Receive IPC Award for New Flexible Circuitry Testing Standards
February 15, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute

MacDermid Enthone Electronics Solutions, a business of Platform Specialty Products Corporation, congratulates Neil Bolding, a senior technologist at MacDermid Enthone, for his contribution to the reliability of printed electronics devices. In collaboration with the IPC technical committee D-65, co-chaired with Dr. Weifeng Liu of Flex (formerly Flextronics), Bolding and the team recently published IPC-9204, "Guideline on Flexibility and Stretchability Testing for Printed Electronics". For their efforts, Bolding and Dr. Liu received IPC's Distinguished Committee Service award during this year's IPC APEX EXPO event.
The new specification is essential for the more widespread adoption of cost-effective printed electronics that require durability to flexing and stretching. Bolding describes the new specification, "Standardizing the flexibility and stretching requirements, and the test methods used to quantify those, is extra challenging due to the wide variety of materials and applications in this space. Working with such a talented group of technologists made our work more productive and enjoyable. The industry will benefit immediately from this enabling document."
As part of MacDermid Autotype for many years, Bolding possesses a unique perspective on printed electronics. He intersects with the three groups involved with materials supplied to this emerging interconnect segment, MacDermid Enthone, MacDermid Graphics Solutions, and MacDermid Autotype. Each of these businesses is part of MacDermid Performance Solutions, a Platform Specialty Products company. The collaboration is an excellent example of the supply chain support MPS can bring to its customers; in this case, Bolding contributes expertise on films, printing technologies, electronics manufacturing, and specialty chemical processing.
MacDermid Performance Solutions is a subsidiary of Platform Specialty Products Corporation. Our businesses manufacture a broad range of specialty chemicals and materials which are used in multi-step technological processes that enhance the products people use every day. Our innovative materials and processes are creating more opportunities and efficiencies for companies across key industries – including electronics, graphic arts, metal & plastic plating, and offshore oil production.
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.