IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO
March 1, 2017 | IPCEstimated reading time: 11 minutes
IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
For their significant contributions to the 2016-2017 IPC APEX EXPO Technical Program Committee, David Hoover, TTM Technologies, and Jeff Schake, ASM Assembly Systems, earned a Special Recognition Award.
For their leadership of the 2-16 Subcommittee that developed Amendment 1 to IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, Gary Carter, Thing Weaver Solutions, LLC and Karen McConnell, Northrop Grumman, earned a Committee Leadership Award. For their contributions to IPC-2581B, Amendment 1, Edward Acheson, Cadence Design Systems; Tomas Bergsten, Ericsson AB; Joseph Clark, DownStream Technologies, LLC; Larry Frost, Sanmina Corporation; Terry Hoffman, Cisco Systems Inc.; Ronny Kovartovsky, Frontline PCB Solutions; Humair Mandavia, Zuken USA Inc.; William Newhard, DownStream Technologies, LLC; James Pierce, Axiom Electronics; Hemant Shah, Cadence Design Systems; Chris Shaw, Fujitsu Network Communications; John Vaughn, Fujitsu Network Communications; Steve Watt, Zuken USA Inc.; and Jamie Wise, WISE Software Solutions Inc., earned a Distinguished Committee Service Award.
For their leadership of the 7-31FT Technical Training Task Group that developed the certification and training program for IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Gregg Owens, Millennium Space Systems and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC/WHMA-A-620C, Floyd Bertagnolli, STM – Service To Mankind and Craig Parker, STM - Service To Mankind, earned a Special Recognition Award. For their contributions to the IPC/WHMA-A-620C certification and training program, Shelley Holt, L-3 Communications; Sean Keating, Amphenol Limited (UK); George Millman, Raytheon Missile Systems; Agnieszka Ozarowski, BAE Systems; Richard Rumas, Honeywell Canada; and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.
For their leadership of the 7-34T Technical Training Task Group that developed the certification and training Program for the IPC-7711C/7721C, Rework, Modification, and Repair of Electronic Assemblies, Daniel Foster, Missile Defense Agency and Zenaida Valianu, Celestica, earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC-7711C/7721C, Dorothy Cornell, Blackfox Training Institute and Jamie Noland, Blackfox Training Institute, earned a Special Recognition Award. For their contributions to the IPC-7711C/7721C certification and training program, Stephen Fribbins, Fribbins Training Services; Garry McGuire, NASA Marshall Space Flight Center; Norman Mier, BEST Inc.; Leo Lambert, EPTAC Corporation; John Vickers, Advanced Rework Technology-A.R.T.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Distinguished Committee Service Award.
For their leadership of the 2-18h task group that developed IPC-1755, Conflict Minerals Data Exchange Amendment 2, Eric Straw, Rockwell Collins and Aidan Turnbull, BomCheckNet, earned a Committee Leadership Award. For their contributions to IPC-1755, WAM2, Kazuko Andersen, JEITA; Brenda Baney, B Cubed Consulting, Inc.; David Carnevale, Dolby Laboratories; Forrest Christian, Innovation Machine Ltd.; Bryan Fiereck, Intel Corporation; David Fitton, Diodes Incorporated; Randy Flinders, GreenSoft Technology Inc.; Shiho Ichimura, Panasonic; JEITA, Nikki Johnson, Total Parts Plus; Hiroshi Kobayashi, TDK; Chuck LePard, Hewlett-Packard; N. Nagaraj, Papros, Inc.; Manish Patel, Axon Circuit Inc.; David Pinksy, Raytheon; John Plyler, Blackberry; Michael Wurzman, RSJ Technical Consulting; Akimasa Yamakawa, Murata Manufacturing Co., ltd.; and Tolga Yaprak, iPoint Inc., earned a Distinguished Committee Service Award.
For their leadership of the 7-31f Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Bud Bowen, Winchester Electronics Division; Brett Miller, USA Harness Inc.; George Millman, Raytheon Missile Systems; and Richard Rumas, Honeywell Canada, earned a Committee Leadership Award. For their significant contributions to IPC/WHMA-A-620C, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Rick Hawthorne, TE Connectivity; Joseph Kane, BAE Systems Platform Solutions; Garry McGuire, NASA Marshall Space Flight Center; Scott Meyer, UTC Aerospace Systems; Gregg Owens, Millennium Space Systems; Zenaida Valianu, Celestica; Jonathon Vermillion, Ball Aerospace & Technologies Corp.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Special Recognition Award. For their contributions to IPC/WHMA-A-620C, Bee Kar Ang, Honeywell Aerospace; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Daniel Foster, Missile Defense Agency; Symon Franklin, Custom Interconnect Ltd; Ben Gross, PRAIRIElectric; Catherine Hanlin, Precision Manufacturing Company, Inc.; Dave Harrell, ViaSat Inc.; Sharissa Johns, Lockheed Martin Missiles & Fire Control; Kathy Johnston, Raytheon Missile Systems; Leo Lambert, EPTAC Corporation; T. John Laser, L-3 Communications; Gary Latta, SAIC; Randy McNutt, Northrop Grumman Aerospace Systems; David Mitchell, Lockheed Martin Mission Systems & Training; Mary Muller, Crane Aerospace & Electronics; Agnieszka Ozarowski, BAE Systems; Robert Potysman, AssembleTronics, LLC; Erik Quam, Schlumberger Well Services; John Tinker, Teledyne Reynolds; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned a Distinguished Committee Service Award.
For her leadership of the IPC E-22 Subcommittee that developed IPC-1071B, Intellectual Property Protection in Printed Board Manufacturing, Pat Stroman, Sparton Corporation, earned a Committee Leadership Award. For their contributions to IPC-1071B, Don Dupriest, Lockheed Martin Missiles & Fire Control; Dennis Fritz, SAIC; Crystal Schneider, Lockheed Martin Missiles & Fire Control; and Richard Snogren, Bristelcone LLC, earned a Distinguished Committee Service Award.
For his leadership of the E-21 Subcommittee that developed IPC-1072, Amendment 1, Intellectual Property Protection in Electronic Assembly Manufacturing, Dennis Fritz, SAIC, earned a Committee Leadership Award. For their contributions to IPC-1072, Amendment 1, Robert Cooke, NASA Johnson Space Center; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Jennie Hwang, H-Technologies Group; Richard Snogren, Bristelcone LLC; Pat Stroman, Sparton Corporation; and Steve Vetter, NSWC Crane, earned a Distinguished Committee Service Award.
Page 1 of 2
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.