-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IEC Expands Sales and Service Partnership with Kodak
March 1, 2017 | International Electronic Components Inc.Estimated reading time: 1 minute
International Electronic Components Inc. (IEC) and Kodak are pleased to announce a partnership expansion. IEC has been awarded additional North American sales, service and distribution rights to Kodak PCB film and chemicals in the United States, including North East, Mid-Atlantic, Southeast and Texas. This expansion adds to our legacy territories in Northern California, the Pacific North West, Mountain States and Canada.
For customers, the addition of these territories means an integrated North American service and supply network of tier one products, equipment and services from IEC. This includes over fifty years of proven expertise on the part of IEC in sales, service and supply chain. For IEC, this helps to continue to evolve our North American footprint and solidify over twenty-five years of partnership between IEC and Kodak.
"We're excited to build on our relationship with Kodak and bring world class products and services to new customers and territories," says Shawn Stone, President of IEC. "What we do is industry-leading and we're thrilled at the opportunity to provide an integrated service offering to printed circuit board manufacturers in these territories."
IEC, a leading sales and service provider of consumables used in the printed circuit board market, specializing in chemistry, dry films, copper clad laminates, prepreg materials and equipment. With conversion and warehousing facilities in Santa Clara, Chicago and Toronto, IEC is positioned to provide timely service and supply to these additional territories in partnership with Kodak. Flagship products distributed by IEC include Kodak Silver Film, Dow, Eternal and ITEQ for printed circuit board manufacturers.
"It's exciting for us, too," Tom Brennan of Kodak says. The company is a leading manufacturer of film developed exclusively for printed circuit board applications using advanced techniques developed by Kodak’s century of imaging experience. "We're looking forward to expanding our relationship with IEC - they have proven their ability to service and supply our customers over many years."
IEC would also like to extend its appreciation for the success and legacy support that Electronic Circuit Supplies Inc. has provided customers over the years. We wish to thank Ron Krone and the late Marty Georgia for their service to the industry. They have been great colleagues and friends to our team at IEC.
For more information about IEC, please contact Shawn Stone, president, at shawn.stone@ieccan.com.
For more information about Kodak, please contact Tom Brennan at thomas.brennan@kodak.com.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.