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ICT 2026 Annual Symposium Review (Part 1): What Lies Ahead?

10/22/2026 | Pete Starkey, FInstCT
It was a misty autumn morning on the outskirts of Coventry in the Midlands of England for the 2026 Annual Symposium of the Institute of Circuit Technology. ICT technical director Alun Morgan welcomed delegates and remarked upon the excellent attendance. Although there were plenty of familiar faces in the audience, an encouraging number of hands were raised when Morgan enquired who was there for the first time. Remarking that although the Institute had seen a lot of changes since it was founded in the 1970s, the time for reminiscing was in the bar and the purpose of the symposium was to talk about the future, hear some new ideas, and discuss where we were going as an industry.

The Big Picture: Not One, But Three Grey Rhinos

09/30/2026 | Mehul Davé -- Column: The Big Picture
Copper just touched a record high, and laminate suppliers have raised prices in double-digit increments across separate rounds. Oil spiked, collapsed, and is climbing again. Tariffs keep shifting under everyone's feet. If you say all of that in one breath, it sounds like a single undifferentiated mess: Everything costs more, and nobody's sure why or when it stops.

WELLER Highlights IPC Class and CTI for Reliable PCB Manufacturing

09/24/2026 | ACCESSWIRE
WELLER PCB is highlighting the importance of defining IPC manufacturing class and PCB laminate requirements before a project enters production, especially for industrial, high-voltage and reliability-sensitive electronics.

High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.

A Practical Approach to Material Selection for High Power PCBs

08/17/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.
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