-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Alpha's Preform Innovations to be Showcased at WIN Eurasia Automation Show
March 8, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will have its latest product innovations, including its range of preform products, showcased by ER-SA Elektrik, its distributor for Turkey, at the WIN Eurasia Automation Show in Istanbul on March 16-19, 2017.
Visitors to the show will be able to attend a seminar on Alpha's latest Preform products hosted by Daniele Perico, Alpha’s Preform Sales Development Manager for Europe on Tuesday 16th March. Alpha offers a wide variety of preform products for a large number of applications including wire harness assembly, die attach, power module assembly, solder junction box, electronic and electrical device build and many others.
Alpha’s Preform innovations include products such as ALPHA® Exactalloy® Preforms and ALPHA® TrueHeight® Spacer Blocks. ALPHA® Exactalloy® Preforms in Tape and Reel Packaging provide an automated method to selectively increase solder volume on a per pad basis using standard assembly equipment. The combination of preforms and solder paste optimizes solder volume and enhances joint strength and reliability. Furthermore, using preforms with solder paste for hole fill can eliminate wave soldering, which represents a significant cost saving opportunity. ALPHA® TrueHeight® Spacer Blocks are burr free, non-collapse copper discs coated with a barrier layer of nickel, and finish coated with flash gold to provide precise standoff height.
To find out more about Alpha’s Preform Products please visit ER-SA Elektrik in Hall 8 Booth #F100 or visit the Alpha website.
WIN Eurasia Automation
Date: Thursday 16th March – Sunday 19th March 2017
Venue: TUYAP Convention and Congress Center, Istanbul, Turkey
Website: http://www.win-automation.com/en
About ER-SA Elektrik
ERSA-Elektrik have 12 years’ experience supplying electronic assembly materials across Turkey. The company, which is mainly based in the Istanbul area, has sites throughout the country, including a site in Ankara which opened at the beginning of 2015. This site includes a team of 4 people dedicated to selling Alpha products.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.