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Siemens to Acquire Precision Innovations to Expand AI-Powered Chip Design Optimization

07/20/2026 | Siemens
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.

Foxconn Debuted EVs, AI Data Center at Japan-Taiwan Exhibition

07/20/2026 | Foxconn
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Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

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DFM Mistakes Designers Make When Moving to ELIC

07/20/2026 | Anaya Vardya, American Standard Circuits
The transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.

Smart Eye Secures Additional Interior Sensing Order with Major Global OEM

07/20/2026 | Smart Eye
Smart Eye, a leading developer of Driver Monitoring System (DMS) and interior sensing software for the automotive industry, has secured an additional order from a major Global OEM.
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