-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
GPC Electronics Enhances Inspection Capabilities
March 30, 2017 | GPC ElectronicsEstimated reading time: 1 minute
Modern communications products are becoming more challenging to manufacture with high density of placements and miniature devices. As a result, traditional human eye inspection methods are no longer effective. For example, 0201 is now common and 01005 and 008004 (0.25mm x 0.125mm) are coming through. These types of components cannot be effectively inspected by the human-eye, even with the aid of modern camera based inspection systems.
Older AOI systems were unreliable and ineffective due to the high level of operator intervention required due to “false failures” and the need to fine tune the equipment on-line. The ability to use flying probe and in-circuit test (ICT) becomes costly and impractical due to high component density that then results in a lack of test access.
When a number of OEMs in the field of high speed networking and communications products partnered with GPC Electronics, the challenge was verifying PCBA products with typically more than 5,000 placements, component footprints of 0201 or less and with limited or no test access.
The answer was to invest in the most modern AOI equipment available. With installations in GPC Electronics’ Australian, New Zealand and Chinese factories, the advanced AOI provides faster and more reliable inspection. The GPC Electronics advanced AOI can detect a comprehensive range of defects and errors. The key feature is the 4 MPX color camera with an optical resolution of 10µm–15µm. The advanced AOI uses dynamic imaging and its inspection functions include detecting missing components, tomb-stoning, bill-boarding, polarity resolution, wrong marking (OCV) and upside down or defective components. It can also detect excess solder, insufficient solder, bridging, through-hole pins as well as scratches and contamination. All this can be achieved in seconds even for the highest density PCBA’s, whereas more traditional test methods such as flying probe may take 10 minutes or more and still not provide adequate test coverage.
In addition to the ability to remove human eye inspection and achieve faster cycle times, the advanced AOI system provides GPC Electronics rapid process feedback. Moreover, due to the pre-determined programmed parameters, faults can be identified with consistency well before any final or functional test. This early stage verification provides higher product yields and the ability to rationalize down-stream test processes.
Reliability and consistency are the key to driving efficiency and low cost. The introduction of advanced AOI equipment has provided a valuable addition to GPC Electronics' capabilities.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.