-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
GPC Electronics Enhances Inspection Capabilities
March 30, 2017 | GPC ElectronicsEstimated reading time: 1 minute
Modern communications products are becoming more challenging to manufacture with high density of placements and miniature devices. As a result, traditional human eye inspection methods are no longer effective. For example, 0201 is now common and 01005 and 008004 (0.25mm x 0.125mm) are coming through. These types of components cannot be effectively inspected by the human-eye, even with the aid of modern camera based inspection systems.
Older AOI systems were unreliable and ineffective due to the high level of operator intervention required due to “false failures” and the need to fine tune the equipment on-line. The ability to use flying probe and in-circuit test (ICT) becomes costly and impractical due to high component density that then results in a lack of test access.
When a number of OEMs in the field of high speed networking and communications products partnered with GPC Electronics, the challenge was verifying PCBA products with typically more than 5,000 placements, component footprints of 0201 or less and with limited or no test access.
The answer was to invest in the most modern AOI equipment available. With installations in GPC Electronics’ Australian, New Zealand and Chinese factories, the advanced AOI provides faster and more reliable inspection. The GPC Electronics advanced AOI can detect a comprehensive range of defects and errors. The key feature is the 4 MPX color camera with an optical resolution of 10µm–15µm. The advanced AOI uses dynamic imaging and its inspection functions include detecting missing components, tomb-stoning, bill-boarding, polarity resolution, wrong marking (OCV) and upside down or defective components. It can also detect excess solder, insufficient solder, bridging, through-hole pins as well as scratches and contamination. All this can be achieved in seconds even for the highest density PCBA’s, whereas more traditional test methods such as flying probe may take 10 minutes or more and still not provide adequate test coverage.
In addition to the ability to remove human eye inspection and achieve faster cycle times, the advanced AOI system provides GPC Electronics rapid process feedback. Moreover, due to the pre-determined programmed parameters, faults can be identified with consistency well before any final or functional test. This early stage verification provides higher product yields and the ability to rationalize down-stream test processes.
Reliability and consistency are the key to driving efficiency and low cost. The introduction of advanced AOI equipment has provided a valuable addition to GPC Electronics' capabilities.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.