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Indium Features Reclaim and Recycle Program at SVC TechCon 2017
April 5, 2017 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon), which will be held from April 29–May 4 in Providence, Rhode Island.
SVC TechCon, now holding its 60th annual technical conference, is the trade event dedicated to vacuum coating technologies. The TechCon presents stimulating content across all nine of its coating technology categories, plus an in-depth exploration of this year’s Symposium Topic, Coatings for Healthcare, Biometric Monitoring, and Bio-Interfaces. Each technical session will mix basic and applied research with innovations and tools to transition R&D results into production.
At the event, Indium will showcase its reclaim services for most indium-containing materials, including: ITO, IZO, IGZO; spent targets; used bonding materials; other unneeded or excess materials; and worn out/replaced cryogenic seals.
For information about Indium Corporation’s reclaim and recycling programs, visit Booth #713.
About Indium
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
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