Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
RTW IPC APEX EXPO: Sanjay Huprikar Lays Out Plans to Grow IPC Membership
April 5, 2017 | Real Time with...IPCEstimated reading time: Less than a minute
Sanjay Huprikar, IPCs vice president of member success, discusses IPCs plans to expand membership around the world.
Share on:
Suggested Items
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
06/18/2025 | Chris Mitchell -- Column: The Government CircuitI had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Real Time with... IPC APEX EXPO 2025: Technological Advancements – IPC's Vision for 2025
04/16/2025 | Real Time with...IPC APEX EXPONolan Johnson introduces Matt Kelly, the CTO and VP Standards & Technology at IPC, who shares insights on recent organizational changes. He highlights the importance of proactive standards development to match the rapid pace of technology, predicting a tenfold acceleration in advancements over the next five years. IPC's core initiatives for 2025 focus on design, advanced electronics packaging, and digital manufacturing, aiming to create new guidelines and standards that meet industry demands.
Dieter Bergman IPC Fellowship Award Presented to Hiroyuki Watanabe, NEC Corporation, at IPC APEX EXPO 2025
03/24/2025 | IPCThe Dieter Bergman IPC Fellowship Award was presented to Hiroyuki Watanabe, NEC Corporation, an IPC Board Member and long-time volunteer, at IPC APEX EXPO 2025 in Anaheim, California.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in