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SelectConnect Technologies Publishes White Paper on Laser Direct Structuring
April 5, 2017 | SelectConnect TechnologiesEstimated reading time: 1 minute
SelectConnect Technologies has published the white paper, “Trace Width and Space Limitations for Laser Direct Structuring.” The white paper details a study that was conducted to determine how close laser direct structuring (LDS) traces can be created and metallized without inducing over plating or bridging on PET/PBT material.
A geometric pattern with varying trace widths and spacing distances were structured onto plaques made from the three different materials. The plaques were subsequently plated with copper, nickel, and immersion gold and examined for signs of over plating. Trace widths and spacing were measured using video microscopy equipment.
Laser direct structuring (LDS) is the first step of a manufacturing process that creates circuit traces on three-dimensional molded thermoplastic components. Currently the leading technology for producing cell phone antennas, LDS has also been widely employed to manufacture a range of components for use in medical devices, security shields, automotive sensors, and GPS antennas-- anywhere product miniaturization requires embedding circuits onto a molded component of a device.
About SelectConnect Technologies
SelectConnect Technologies specializes in the production of three-dimensional molded interconnect devices (3D-MID), offering both laser direct structuring (LDS) and 2-shot injection capabilities. Working with LPKF since 2010, the company has produced thousands of laser direct structured components for a wide range of applications. With expertise in electroless metallization, SelectConnect also produces molded interconnect device plating to construct circuitry with the comparable function and performance of a printed circuit board.
To read and download the white paper, please click here or email solutions@selectconnettech.com.
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